Patents by Inventor Mitsuru Nozaki
Mitsuru Nozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9949371Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.Type: GrantFiled: August 19, 2016Date of Patent: April 17, 2018Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., PI R&D CO., LTD.Inventors: Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
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Publication number: 20160360615Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 ?m to 3.0 ?m and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.Type: ApplicationFiled: August 19, 2016Publication date: December 8, 2016Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., PI R&D CO., LTD.Inventors: Mitsuru NOZAKI, Akihiro NOMOTO, Norikatsu AKIYAMA, Eiji NAGATA, Masashi YANO
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Publication number: 20120189859Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 ?m to 3.0 ?m and a lightness value of not more than 30 on one surface of an electrolytic copper foil, and form a layer of a resin composition containing a block copolymerized polyimide resin having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.Type: ApplicationFiled: June 25, 2010Publication date: July 26, 2012Applicants: PI R&D CO., LTD., MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
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Publication number: 20110281126Abstract: This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.Type: ApplicationFiled: December 10, 2009Publication date: November 17, 2011Inventors: Mitsuru Nozaki, Takabumi Oomori, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
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Patent number: 7989081Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.Type: GrantFiled: January 25, 2007Date of Patent: August 2, 2011Assignees: Mitsubishi Gas Chemical Company, Inc., PI R&D Co., Ltd.Inventors: Mitsuru Nozaki, Morio Gaku, Yasuo Tanaka, Eiji Nagata, Yasuo Kikuchi, Masashi Yano
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Patent number: 7892651Abstract: A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.Type: GrantFiled: September 13, 2005Date of Patent: February 22, 2011Assignees: Mitsubishi Gas Chemical Company, Inc., PI R&D Co., Ltd.Inventors: Takabumi Omori, Mitsuru Nozaki, Eiji Nagata, Masashi Yano
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Publication number: 20070172674Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.Type: ApplicationFiled: January 25, 2007Publication date: July 26, 2007Inventors: Mitsuru Nozaki, Morio Gaku, Yasuo Tanaka, Eiji Nagata, Yasuo Kikuchi, Masashi Yano
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Patent number: 7192651Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.Type: GrantFiled: August 17, 2004Date of Patent: March 20, 2007Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo, Mitsuru Nozaki, Seiji Shika
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Publication number: 20060093824Abstract: A thermosetting resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule, a bismaleimide (b) represented by the formula (1) wherein each of R1, R2, R3, and R4 is independently an alkyl group having 3 or less carbon atoms, and a bismaleimide (c) represented by the formula (2), a copper-clad laminate comprising the above thermosetting resin composition and a printed wiring board comprising the above copper-clad laminate.Type: ApplicationFiled: October 18, 2005Publication date: May 4, 2006Inventor: Mitsuru Nozaki
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Publication number: 20060054589Abstract: A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.Type: ApplicationFiled: September 13, 2005Publication date: March 16, 2006Inventors: Takabumi Omori, Mitsuru Nozaki, Eiji Nagata, Masashi Yano
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Publication number: 20050277743Abstract: A resin composition improved in resistance to crack and having elasticity and high heat resistance, which composition contains a cyanate ester resin (a) having at least two cyanate groups per molecule and a bismaleimide compound (b) represented by the following formula (1), a copper-clad laminate using the above resin composition and a printed wiring board using the above copper-clad laminate, wherein n is an average value and is in the range of from 1 to 30.Type: ApplicationFiled: June 3, 2005Publication date: December 15, 2005Inventor: Mitsuru Nozaki
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Publication number: 20050042466Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.Type: ApplicationFiled: August 17, 2004Publication date: February 24, 2005Inventors: Daisuke Ohno, Kenji Ishii, Yasumasa Norisue, Michio Nawata, Yoshinori Kondo, Mitsuru Nozaki, Seiji Shika
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Patent number: 6229096Abstract: There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290° C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290° C. or higher and is in the form of a film having holes including at least 5 holes/mm2 each with an area of opening of 400 to 1000 &mgr;m2 (component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.Type: GrantFiled: October 6, 1998Date of Patent: May 8, 2001Assignees: Mitsubishi Gas Chemical Company, Inc., Kuraray Co., Ltd.Inventors: Morio Gaku, Mitsuru Nozaki, Kenji Saimen, Tamemaru Esaki
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Patent number: 5692940Abstract: A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.Type: GrantFiled: July 15, 1996Date of Patent: December 2, 1997Assignees: Mitsubishi Gas Chemical Company, Ltd., Japan Vilene Company, Ltd.Inventors: Hidenori Kinbara, Mitsuru Nozaki, Masanobu Mizoguchi, Koji Kimura, Naohiko Shimono
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Patent number: 5186880Abstract: The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.Type: GrantFiled: July 3, 1990Date of Patent: February 16, 1993Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Morio Gaku, Mitsuru Nozaki
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Patent number: 4764327Abstract: A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin comType: GrantFiled: January 14, 1987Date of Patent: August 16, 1988Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Mitsuru Nozaki, Hirokatsu Nakamura
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Patent number: 4740343Abstract: A method for producing a rigid resin mold for preparing plastic moldings which comprises:(1) preparing a composition (I) consisting essentially of(A) a cyanate ester resin composition, and(B-1) a metallic substance which does not substantially accelerate gelation of the cyanate ester resin composition (A),(2) preparing a composition (II) consisting essentially of(C) epoxy resin, and(B-2) a metallic substance which accelerates gelation of the cyanate ester resin composition (A) and does not substantially accelerate gelation of the epoxy resin (C) at temperatures below or equal to 100.degree. C.,(3) mixing composition (I) of step (1) and composition (II) of step (2) to form composition (III),(4) casting composition (III) of step (3) into a mold(5) and gelling the cast resin.Type: GrantFiled: March 25, 1987Date of Patent: April 26, 1988Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Morio Gaku, Hidenori Kimbara, Jun Yokoi, Yasunari Osaki, Mitsuru Nozaki