Patents by Inventor Mitsuru Obo

Mitsuru Obo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shield method for electronic component enclosure and shield material
    Patent number: 8015690
    Abstract: The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.
    Type: Grant
    Filed: September 15, 2008
    Date of Patent: September 13, 2011
    Assignees: SMK Corporation, Namics Corporation
    Inventors: Yoshikazu Ueno, Haruhiko Kondo, Harumi Kano, Mitsuru Obo, Akito Yoshii, Masahiro Kitamura, Hidenori Iida, Shin Teraki