Patents by Inventor Mitsuru Okuyama

Mitsuru Okuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050164000
    Abstract: A thick foam molding having a size permitting the formation of a sphere having a diameter of at least 200 mm by cutting. The foam molding is obtainable by molding expanded thermoplastic resin beads in a mold cavity and having a fusion-bonding efficiency of at least 50% throughout, wherein each of the expanded thermoplastic resin beads comprises a core which is in an expanded state and which comprises a crystalline thermoplastic resin, and a coat which is in a substantially unexpanded state and which surrounds the core. The coat comprises a crystalline polyolefin polymer which is lower in melting point by at least 15° C. than that of the crystalline thermoplastic resin or a non-crystalline polyolefin polymer which is lower in Vicat softening point by at least 15° C. than that of the crystalline thermoplastic resin.
    Type: Application
    Filed: January 19, 2005
    Publication date: July 28, 2005
    Applicant: JSP CORPORATION
    Inventors: Mitsuru Okuyama, Kunikazu Nagasaki