Abstract: A flexible rigid printed wiring board includes a plurality of rigid wiring boards having wiring patterns. The rigid wiring boards are spatially separate from each other. The flexible rigid printed wiring board also includes a flexible portion. The flexible portion connects the rigid wiring boards, and includes an insulating and flexible resin sheet. The insulating and flexible resin sheet includes first portions of first and second sub resin sheets. The first portions of the first and second sub resin sheets are bonded together. The first and second sub resin sheets have second portions covering and adhering to surfaces of the rigid wiring boards.

Abstract: A flexible rigid printed wiring board includes a plurality of rigid wiring boards having wiring patterns. The rigid wiring boards are spatially separate from each other. The flexible rigid printed wiring board also includes a flexible portion. The flexible portion connects the rigid wiring boards, and includes an insulating and flexible resin sheet. The insulating and flexible resin sheet includes first portions of first and second sub resin sheets. The first portions of the first and second sub resin sheets are bonded together. The first and second sub resin sheets have second portions covering and adhering to surfaces of the rigid wiring boards.

Abstract: The invention provides a production method capable of forming a thin film resistance element having a thickness and a shape controlled in a high accuracy in a printed circuit board. The production method of a thin film resistance element formed on a printed circuit board, has the steps of forming a thin film resistance layer having a predetermined thickness on the printed circuit board through an insulation layer by a dry process used in producing a semiconductor, forming an electrically conductive layer on the thin resistance layer, and etching the electrically conductive layer selectively so as to make, at least, a pair of electrically conductive pads, resulting in the thin film resistance element having a predetermined value of resistivity between the pair of electrically conductive pads. Thereby, it is possible to form the thin film resistance element having a thickness and a shape controlled in a high accuracy on the printed circuit board.

Abstract: The invention provides a production method capable of forming a thin film resistance element having a thickness and a shape controlled in a high accuracy in a printed circuit board (core material). The production method of a thin film resistance element formed on a printed circuit board, has the steps of forming a thin film resistance layer having a predetermined thickness on the printed circuit board through an insulation layer by a dry process used in producing a semiconductor, forming an electrically conductive layer on the thin resistance layer, and etching the electrically conductive layer selectively so as to make, at least, a pair of electrically conductive pads, resulting in the thin film resistance element having a predetermined value of resistivity between the pair of electrically conductive pads. Thereby, it is possible to form the thin film resistance element having a thickness and a shape controlled in a high accuracy on the printed circuit board (core material).