Abstract: A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.

Abstract: A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for external connection. In the semiconductor device mounted on a substrate in the semiconductor device assembly, a semiconductor element shaped to have a thickness ranging from 200 &mgr;m to 10 &mgr;m has reduced flexural rigidity so as to be easily deflected. In the status that the bumps are joined to corresponding circuitry electrodes on the substrate, the semiconductor element can deflect at other portions other than its surface between two adjacent bumps according to contraction and distortion of the substrate. This allows the bumps to be dislocated in a direction parallel to a surface of the semiconductor element, hence relieving stress developed by the contraction of the substrate at the joint positions between the bumps and the circuitry electrodes.

Abstract: The object of the present invention is to provide a bonding paste applicator and a method of applying a bonding paste which allow satisfactory paste applying quality and excellent operability to be realized. A bonding paste application method for applying a bonding paste by making a drawing with a paste applying nozzle made to move to a position, where a chip is mounted on a substrate, comprises the steps of storing in advance in a storing unit 46 a drawing pattern for controlling each of X, Y and Z axes to move a paste applying nozzle and a drawing pattern setting table 53 to show a category corresponding to the size of a chip to be bonded, selecting a drawing pattern corresponding to the size of the chip, which has been designated, by means of a drawing pattern selecting unit 54 and obtaining a speed pattern for each of the X, Y and Z axes based on the selected drawing pattern by means of a speed pattern computing unit 55.

Abstract: A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequently near the center, has a shortened cycle time, and applies the paste uniformly.

Abstract: A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for external connection. In the semiconductor device mounted on a substrate in the semiconductor device assembly, a semiconductor element shaped to have a thickness ranging 200 &mgr;m to 10 &mgr;m has reduced flexural rigidity so as to be easily deflected. In the status that the bumps are joined to corresponding circuitry electrodes on the substrate, the semiconductor element can deflect at other portion than its surface between two adjacent bumps according to contraction and distortion of the substrate. This allows the bumps to be dislocated in a parallel direction with a surface of the semiconductor element, hence relieving a stress developed by the contraction of the substrate at the joint positions between the bumps and the circuitry electrodes.

Abstract: A semiconductor device having a thinned semiconductor element allowed to be easily handled, and a method of manufacturing the device are provided. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed surface of the semiconductor element with an adhesive. The adhesive has a low elastic modulus and easily expands and contracts after bonding, and bonds the semiconductor element to the bumper member while allowing the semiconductor element to be deformed. Thus, the semiconductor device can easily be handled, and the semiconductor element can be deformed in responsive to the deformation of a substrate after being mounted. In addition, a thermal stress in a heat cycle can be alleviated effectively.

Abstract: A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.

Abstract: A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.

Abstract: In a paste applying method for applying paste in an application area set on the surface of the object to be applied, the application efficiency is enhanced and the application quality is improved by applying the paste in an undulation pattern of convex and concave shape that defines the interior of the surface of the object on which no paste is deposited, where the interior area is substantially enclosed by the undulation pattern of the paste. A discharge port of an application nozzle is moved with one continuous line from an application start point to an application end point along the moving route by a plurality of passing points. The plurality of passing points are set at each comer of the application area and include a plurality of first passing points and a plurality of second passing points, where the first passing points are set at each corner of the application area and the second passing points are set at the central side of the application area.

Abstract: A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequency near the center, has the cycle time shortened, and applies the paste uniformly.

Abstract: The method of manufacturing a semiconductor device of the present invention comprises: forming a resin layer on a surface of a semiconductor wafer on which a plurality of semiconductor elements are formed, forming through-holes on the resin layer, a first cutting of either the semiconductor wafer or the resin layer, mounting conductive balls on the through-hole, connecting the conductive ball to electrodes of the semiconductor element, and a second cutting for dividing the wafer into each piece of semiconductor devices. With the processes of the present invention, conductive balls can be easily and effectively mounted on a wafer under optimum conditions, without failure such as slipping or falling down from the required position. This fact contributes to an increased efficiency and a good productivity in the production of semiconductor devices.

Abstract: A method of mounting bumped electronic components without using a flux during the solder joining process, which is low in cost and offers high reliability of the assembly. Resin adhesive 4 containing filler particles 4a is applied to a board 1 formed with electrodes 2, and a bumped electronic component 5 is mounted onto the board 1 to press the bumps 7 of the electronic component 5 against the electrodes 2 of the board 1. As a result, the oxide films 7a over the surfaces of the solder bumps 7 are broken by the filler particles 4a present in a gap between the lower ends of the solder bumps 7 and the surfaces of the electrodes 2, thus exposing the solder. This process eliminates the need for using the flux when the solder bumps 7 are melted and soldered to the electrodes 2, and therefore the cleaning process after soldering is not required, assuring high reliability of the assembly.

Abstract: A method of soldering a bumped work without using flux is provided by the steps of vacuum-sucking the bumped work on a head, pressing a bump against a pad of another work, causing a projection of the bump to partially break an oxide film on the solder portion, to pierce it, and to be placed thereon, and cooling and solidifying the molten solder portion. The surface of the solder portion is coated by the oxide film as a hard shell, so that, even if the bump is firmly pressed against the solder portion, the solder of the solder portion does not flow sidewise, and a solder bridge is not produced.