Patents by Inventor Mitsuru Shinohara

Mitsuru Shinohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10184038
    Abstract: Polylactic acid-based resin expanded beads obtained by releasing a softened, pressurized foamable resin composition, which has a polylactic acid-based resin and a physical blowing agent, to a low pressure atmosphere to foam and expand the resin composition, where the polylactic acid-based resin satisfies the conditions (1) to (3) shown below, and exhibits excellent secondary expansion properties and fusion bonding properties. A polylactic acid-based resin expanded beads molded article obtained by in-mold molding of the polylactic acid-based resin expanded beads exhibits excellent mechanical properties. MT?30 mN??(1) log MT?0.93 log ??1.75??(2) CT1/2?600 sec??(3) where MT represents a melt tension [mN] at 190° C., ? represents a melt viscosity [Pa·s] at 190° C. and a shear speed of 20 sec?1, and CT1/2 represents a half crystallization time [sec] at 110° C.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: January 22, 2019
    Assignee: JSP CORPORATION
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Publication number: 20180251619
    Abstract: The present invention relates to polyolefin resin expanded beads containing multi-layer expanded beads containing a core layer in a foamed state containing a polyolefin resin and a cover layer coated on the core layer, the cover layer containing a mixed resin of a polyolefin resin (A) and at least one resin (B) selected from a polystyrene resin and a polyester resin, and the mixed resin having a weight ratio (A/B) of the polyolefin resin (A) and the resin (B) of from 15/85 to 90/10, and a composite laminated body using an expanded beads molded body thereof, and the expanded beads molded body is excellent in solvent resistance and also excellent in adhesiveness to a thermosetting resin on the surface of the molded body, and can provide a composite laminated body excellent in productivity with a thermosetting resin.
    Type: Application
    Filed: May 7, 2018
    Publication date: September 6, 2018
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Patent number: 9637606
    Abstract: A polylactic acid-based resin foamed molded article having a voidage of 5 to 45% by volume, a bulk density BD [g/cm3] of 0.01 to 0.2 g/cm3 and a ratio FT/BD of a flexural strength FT [MPa] thereof to the bulk density BD in the range of 6 to 25 MPa·cm3/g.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: May 2, 2017
    Assignee: JSP CORPORATION
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Publication number: 20170009038
    Abstract: The present invention relates to polyolefin resin expanded beads containing multi-layer expanded beads containing a core layer in a foamed state containing a polyolefin resin and a cover layer coated on the core layer, the cover layer containing a mixed resin of a polyolefin resin (A) and at least one resin (B) selected from a polystyrene resin and a polyester resin, and the mixed resin having a weight ratio (A/B) of the polyolefin resin (A) and the resin (B) of from 15/85 to 90/10, and a composite laminated body using an expanded beads molded body thereof, and the expanded beads molded body is excellent in solvent resistance and also excellent in adhesiveness to a thermosetting resin on the surface of the molded body, and can provide a composite laminated body excellent in productivity with a thermosetting resin.
    Type: Application
    Filed: March 20, 2015
    Publication date: January 12, 2017
    Applicant: JSP Corporation
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Patent number: 9449735
    Abstract: An electrostatic dissipating molded article having a surface resistivity of 1×105 to 1×1010? and obtained by in-mold molding of multi-layered polyolefin-based resin expanded beads each having an polyolefin-based resin expanded core layer and a polyolefin-based resin cover layer which covers the polyolefin-based resin expanded core layer and which is formed from a polyolefin-based resin (A), a polymeric antistatic agent (B) of a block copolymer of a polyether block and a polyolefin block, and an electrically conductive carbon black (C), the components (A) to (C) being present in a specific proportion.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: September 20, 2016
    Assignee: JSP CORPORATION
    Inventors: Takuya Chiba, Masaharu Oikawa, Mitsuru Shinohara
  • Patent number: 9354419
    Abstract: An axis adjustment device, which may adjust an optical axis mismatch of an optical device at a high precision, and may perform an axis adjustment operation, includes a holding member to hold an optical device, a support member to support the holding member so that the holding member moves within a facing surface, a first rotating member to hold the holding member and rotatably supported around a first point S1 formed at a surface facing the support member, and a second rotating member to hold the holding member and to be rotatably supported around a second point formed at the surface facing the support member. The holding member moves within the surface facing the support member due to a rotation of one of the first and second rotating members and in order to adjust a relative position in a direction orthogonal to an optical axis of the optical device.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: May 31, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Mitsuru Shinohara
  • Publication number: 20160032070
    Abstract: Polylactic acid-based resin expanded beads obtained by releasing a softened, pressurized foamable resin composition, which has a polylactic acid-based resin and a physical blowing agent, to a low pressure atmosphere to foam and expand the resin composition, where the polylactic acid-based resin satisfies the conditions (1) to (3) shown below, and exhibits excellent secondary expansion properties and fusion bonding properties. A polylactic acid-based resin expanded beads molded article obtained by in-mold molding of the polylactic acid-based resin expanded beads exhibits excellent mechanical properties. MT?30 mN??(1) log MT?0.93 log ??1.75??(2) CT1/2?600 sec??(3) where MT represents a melt tension [mN] at 190° C., ? represents a melt viscosity [Pa·s] at 190° C. and a shear speed of 20 sec?1, and CT1/2 represents a half crystallization time [sec] at 110° C.
    Type: Application
    Filed: October 13, 2015
    Publication date: February 4, 2016
    Applicant: JSP CORPORATION
    Inventors: Mitsuru SHINOHARA, Masaharu OIKAWA
  • Patent number: 9230710
    Abstract: An electrostatic dissipative, polypropylene-based resin expanded bead having an expanded core layer of a polypropylene-based resin, and a cover layer that covers the expanded core layer and that is composed of a mixed resin containing electrically conductive carbon black, wherein the mixed resin includes a polypropylene resin which forms a continuous phase and a polyethylene resin which forms dispersed phases dispersed in the continuous phase, with the electrically conductive carbon black being unevenly distributed to the dispersed phases side. In-mold molding of the expanded beads gave a molded article.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: January 5, 2016
    Assignee: JSP CORPORATION
    Inventors: Takuya Chiba, Masaharu Oikawa, Mitsuru Shinohara
  • Patent number: 9206296
    Abstract: An expanded bead of a polylactic acid resin, having an exterior surface, a surface region including the entire exterior surface and having a weight of one-sixth to one-fourth the weight of the expanded bead, and a center region located inside the surface region and having a weight of one-fifth to one-third the weight of the expanded bead, wherein the expanded bead, the surface region and the center region, after having been subjected to a pretreatment including a heat treatment at 110° C. for 120 minutes followed by cooling at a cooling speed of 2° C./min, have endothermic calorific values of (Br:endo), (Brs:endo) and (Brc:endo), respectively, when measured by heat flux differential scanning calorimetry at a heating speed of 2° C./min in accordance with JIS K7122 (1987), and wherein (Br:endo) is greater than 25 J/g and (Brs:endo) is smaller than (Brc:endo) and is not smaller than 0 J/g.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: December 8, 2015
    Assignee: JSP CORPORATION
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Publication number: 20150315351
    Abstract: A polylactic acid-based resin foamed molded article having a voidage of 5 to 45% by volume, a bulk density BD [g/cm3] of 0.01 to 0.2 g/cm3 and a ratio FT/BD of a flexural strength FT [MPa] thereof to the bulk density BD in the range of 6 to 25 MPa·cm3/g.
    Type: Application
    Filed: April 28, 2015
    Publication date: November 5, 2015
    Applicant: JSP CORPORATION
    Inventors: Mitsuru SHINOHARA, Masaharu OIKAWA
  • Patent number: 9097912
    Abstract: A lens barrel includes a first retaining member to retain a first driving unit, a second retaining member to retain a second driving unit, a fixing cylinder in which the first retaining member and the second retaining member are disposed adjacent to each other in an optical axis direction, and a cam cylinder disposed about an outer circumference of the fixing cylinder rotatable in a circumferential direction, and the first and the second retaining members are moveable in the fixing cylinder following a same trajectory according to a rotation of the cam cylinder.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Mitsuru Shinohara
  • Patent number: 9079360
    Abstract: A process produces a polyolefin-based resin expanded beads molded article that is excellent in bending deflection characteristics, high in porosity, low in bulk density and light in weight, and has interconnected void spaces. The process comprises filling, in a mold cavity, multi-layered polyolefin-based resin expanded beads each of which has a cylindrical, polyolefin-based resin expanded core layer and a polyolefin-based resin outer layer covering the expanded core layer and which satisfy specific requirements, introducing steam in the mold cavity to heat the multi-layered expanded beads filled in the mold cavity to fuse bond and mold the multi-layered expanded beads in the mold cavity.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: July 14, 2015
    Assignee: JSP CORPORATION
    Inventors: Tokunobu Nohara, Mitsuru Shinohara, Takuya Chiba, Masaharu Oikawa
  • Patent number: 9023470
    Abstract: Polylactic acid resin expanded beads exhibiting excellent fusion bonding at the time of in-mold molding have such a crystal structure that gives a first time DSC curve when heated according to heat flux differential scanning calorimetry referenced in JIS K7122(1987) and a second time DSC curve when thereafter cooled and then again heated, the second time DSC curve having a fusion peak having a reference peak temperature and the first time DSC curve having at least one fusion peak with a peak temperature higher than the reference peak temperature and another at least one fusion peak with a peak temperature not lower temperature than the reference peak temperature.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: May 5, 2015
    Assignee: JSP Corporation
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Patent number: 9025034
    Abstract: An image blur compensation unit and image blur compensation device that can be made smaller in size. Wedge prisms, which refract light that is guided to an imaging element after passing through a lens group, are disposed on the same plane perpendicular to a central axis, and are supported by rotatable prism support portions. In order for the wedge prisms to be spaced by a predetermined distance and face each other along the central axis in a space that is formed when being placed adjacent to each other, the prism support portion supports the wedge prism on one end side along the central axis, and the prism support portion supports the wedge prism on one end side along the central axis. In this manner, the prism support portions supporting the wedge prisms, which need to be disposed along the central axis so as to be spaced by a predetermined distance and face each other, are disposed on the same plane.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: May 5, 2015
    Assignee: Alpha Labo Solution, Ltd.
    Inventors: Yoshimasa Haraguchi, Mitsuru Shinohara
  • Publication number: 20150102269
    Abstract: An electrostatic dissipative, polypropylene-based resin expanded bead having an expanded core layer of a polypropylene-based resin, and a cover layer that covers the expanded core layer and that is composed of a mixed resin containing electrically conductive carbon black, wherein the mixed resin includes a polypropylene resin which forms a continuous phase and a polyethylene resin which forms dispersed phases dispersed in the continuous phase, with the electrically conductive carbon black being unevenly distributed to the dispersed phases side. In-mold molding of the expanded beads gave a molded article.
    Type: Application
    Filed: February 8, 2013
    Publication date: April 16, 2015
    Applicant: JSP CORPORATION
    Inventors: Takuya Chiba, Masaharu Oikawa, Mitsuru Shinohara
  • Publication number: 20150001451
    Abstract: An electrostatic dissipative, polypropylene-based resin expanded bead containing electrically conductive carbon black, having an apparent density of 10 to 120 kg/m3 and formed of a base resin which includes a polypropylene resin forming a continuous phase, and a polyethylene resin forming dispersed phases dispersed in the continuous phase, with the carbon black being unevenly distributed to the dispersed phases side. The polyethylene resin is an ethylene homopolymer or a copolymer of ethylene and C4 to C6 ?-olefin and a weight ratio of the polypropylene resin to the polyethylene resin is 99.5:0.5 to 65:35. A molded article obtained by in-mold molding of such expanded beads exhibits electrostatic dissipative properties with a surface resistivity in the range of 1×105 to 1×1010? in a stable manner.
    Type: Application
    Filed: December 6, 2012
    Publication date: January 1, 2015
    Applicant: JSP CORPORATION
    Inventors: Takuya Chiba, Masaharu Oikawa, Mitsuru Shinohara
  • Publication number: 20140336289
    Abstract: A process for producing polylactic acid-based resin expanded beads comprises releasing foamable resin particles, which are in a softened state and dispersed in a dispersing medium contained in a pressure resisting closed vessel, to an atmosphere having a pressure lower than that in the closed vessel together with the dispersing medium to foam and expand the foamable particles. The foamable resin particles are obtained by impregnating a physical blowing agent into resin particles which are formed of a modified polylactic acid resin modified with an epoxide and showing specific physical properties when melted.
    Type: Application
    Filed: September 21, 2012
    Publication date: November 13, 2014
    Applicant: JSP CORPORATION
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Publication number: 20140235741
    Abstract: Polylactic acid-based resin expanded beads of the present invention are obtained by releasing a softened, pressurized foamable resin composition, which comprises a polylactic acid-based resin and a physical blowing agent, to a low pressure atmosphere to foam and expand the resin composition, wherein the polylactic acid-based resin satisfies the conditions (1) to (3) shown below, and exhibits excellent secondary expansion properties and fusion bonding properties. A polylactic acid-based resin expanded beads molded article obtained by in-mold molding of the polylactic acid-based resin expanded beads exhibits excellent mechanical properties. MT?30 mN??(1) log MT?0.93 log ??1.75??(2) CT1/2?600 sec??(3) where MT represents a melt tension [mN] at 190° C., ? represents a melt viscosity [Pa·s] at 190° C. and a shear speed of 20 sec?1, and CT1/2 represents a half crystallization time [sec] at 110° C.
    Type: Application
    Filed: August 30, 2012
    Publication date: August 21, 2014
    Applicant: JSP CORPORATION
    Inventors: Mitsuru Shinohara, Masaharu Oikawa
  • Publication number: 20140171524
    Abstract: There is provided polyvinylidene fluoride resin expanded beads which have a high expansion ratio, do not shrink easily, and are capable of obtaining a molded article of the expanded beads that is excellent in mold reproducibility and dimensional stability. The polyvinylidene fluoride resin expanded beads include a polyvinylidene fluoride resin as a base resin, in which a flexural modulus of the polyvinylidene fluoride resin is 450 MPa or more, a melt flow rate (MFR) of the polyvinylidene fluoride resin is 1 g/10 min or more at 230° C. and 2.16 kg load, an apparent density of the expanded beads is 25 to 150 g/L, and a closed cell content of the expanded beads is 80% or more.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicant: JSP CORPORATION
    Inventors: Mitsuru SHINOHARA, Masaharu OIKAWA
  • Publication number: 20140097389
    Abstract: An electrostatic dissipating molded article having a surface resistivity of 1×105 to 1×1010? and obtained by in-mold molding of multi-layered polyolefin-based resin expanded beads each having an polyolefin-based resin expanded core layer and a polyolefin-based resin cover layer which covers the polyolefin-based resin expanded core layer and which is formed from a polyolefin-based resin (A), a polymeric antistatic agent (B) of a block copolymer of a polyether block and a polyolefin block, and an electrically conductive carbon black (C), the components (A) to (C) being present in a specific proportion.
    Type: Application
    Filed: October 7, 2013
    Publication date: April 10, 2014
    Applicant: JSP CORPORATION
    Inventors: Takuya CHIBA, Masaharu OIKAWA, Mitsuru SHINOHARA