Patents by Inventor Mitsuru SUGATA

Mitsuru SUGATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8536024
    Abstract: Provided are a processing method for forming division originating points in a workpiece and a laser processing apparatus performing the method, which are capable of reducing light absorption in a processing trail, increasing light extraction efficiency from sapphire, and performing high speed processing. A pulsed laser beam is irradiated to a workpiece so that irradiation regions for each of unit pulsed beams of the pulsed laser beam of ultra-short pulse are formed discretely in the workpiece, and cleavage or parting of the workpiece is sequentially generated between the irradiation regions by a shock or a stress when each of unit pulsed beam is irradiated at an irradiation point, to thereby form originating points for division in the workpiece.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: September 17, 2013
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Shohei Nagatomo, Mitsuru Sugata, Ikuyoshi Nakatani
  • Publication number: 20110155706
    Abstract: Provided are a processing method for forming division originating points in a workpiece and a laser processing apparatus performing the method, which are capable of reducing light absorption in a processing trail, increasing light extraction efficiency from sapphire, and performing high speed processing. A pulsed laser beam is irradiated to a workpiece so that irradiation regions for each of unit pulsed beams of the pulsed laser beam of ultra-short pulse are formed discretely in the workpiece, and cleavage or parting of the workpiece is sequentially generated between the irradiation regions by a shock or a stress when each of unit pulsed beam is irradiated at an irradiation point, to thereby form originating points for division in the workpiece.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 30, 2011
    Inventors: Shohei NAGATOMO, Mitsuru SUGATA, Ikuyoshi NAKATANI
  • Publication number: 20110100966
    Abstract: A laser processing method for performing laser processing for reducing light absorption on a processing trail is provided. When an irradiated range on a surface of a workpiece is modulated by modulating an irradiating state of a pulse laser beam from a light source, a processed region which has a continuous portion in a first direction and in which a state of a cross section vertical to the first direction changes in the first direction is formed. Concretely, scanning by means of the pulse laser beam is performed under an irradiating condition that beam spots of the laser beam per unit pulse are discrete along the first direction, or scanning by means of the pulse laser beam in the first direction is performed while the irradiation energy of the pulse laser beam is being modulate, or scanning by means of the pulse laser beam in a second direction and a third direction that have predetermined angles with respect to the first direction are alternatively repeated.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 5, 2011
    Inventors: Shohei NAGATOMO, Mitsuru SUGATA, Ikuyoshi NAKATANI