Patents by Inventor Mitsuru TAMASHIRO

Mitsuru TAMASHIRO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10347774
    Abstract: A problem addressed by an embodiment of the present invention lies in providing a UBM structure which includes thin layers and can prevent diffusion of solder into an electrode. The UBM structure according to an embodiment of the present invention includes: a first UBM layer on an electrode, a second UBM layer on the first UBM layer, and a passivated metal layer between the first UBM layer and the second UBM layer. The passivated metal layer functions as a barrier layer with respect to solder diffusion.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: July 9, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Noriyuki Kishi, Tatsuhiro Koizumi, Hiroyuki Shiraki, Mitsuru Tamashiro, Masaya Yamamoto
  • Patent number: 9755098
    Abstract: An embodiment relates to a group II-VI semiconductor wafer of a radiation detector, and an embodiment relates to a method for producing same. An embodiment of the present invention provides a group II-VI semiconductor of a radiation detector enabling reduction or restriction of the edge effect (or the end surface effect) and a method for producing same. An embodiment of the present invention provides a radiation detector obtained by half-cutting or full-cutting a group II-VI semiconductor wafer having a zinc blende structure in which the wafer has a {001} plane main surface, and cut planes according to the half-cutting or full-cutting have an angle ? (?0°) relative to the slip direction of the wafer.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: September 5, 2017
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Noriyuki Kishi, Tatsuhiro Koizumi, Hiroyuki Shiraki, Mitsuru Tamashiro, Masaya Yamamoto
  • Publication number: 20160133776
    Abstract: An embodiment relates to a group II-VI semiconductor radiation detector, and an embodiment relates to a method for producing same. An embodiment of the present invention provides a radiation detector enabling reduction or restriction of the edge effect (or the end surface effect) and a method for producing same. An embodiment of the present invention provides a radiation detector obtained by half-cutting or full-cutting a group II-VI semiconductor wafer having a zinc blende structure in which the wafer has a {001} plane main surface, and cut planes according to the half-cutting or full-cutting have an angle ? (?°) relative to the slip direction of the wafer.
    Type: Application
    Filed: June 6, 2014
    Publication date: May 12, 2016
    Inventors: Noriyuki KISHI, Tatsuhiro KOIZUMI, Hiroyuki SHIRAKI, Mitsuru TAMASHIRO, Masaya YAMAMOTO
  • Publication number: 20150243801
    Abstract: A problem addressed by an embodiment of the present invention lies in providing a UBM structure which includes thin layers and can prevent diffusion of solder into an electrode. The UBM structure according to an embodiment of the present invention includes: a first UBM layer on an electrode, a second UBM layer on the first UBM layer, and a passivated metal layer between the first UBM layer and the second UBM layer. The passivated metal layer functions as a barrier layer with respect to solder diffusion.
    Type: Application
    Filed: February 25, 2015
    Publication date: August 27, 2015
    Inventors: Noriyuki KISHI, Tatsuhiro KOIZUMI, Hiroyuki SHIRAKI, Mitsuru TAMASHIRO, Masaya YAMAMOTO
  • Publication number: 20130161773
    Abstract: A detector element is disclosed, including a semiconducting converter element and a number of pixilated contacts arranged thereon. A radiation detector is also disclosed including such a detector element, along with a medical device having one or more such radiation detectors. Finally, a method for producing a detector element is disclosed, which includes forming pixelated contacts by way of a photolithographic process on the semiconducting converter element using a lithographic mask arranged on a converter element protective layer.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 27, 2013
    Inventors: Fabrice DIERRE, Peter HACKENSCHMIED, Hiroshi KATAKABE, Noriyuki KISHI, Christian SCHRÖTER, Hiroyuki SHIRAKI, Matthias STRASSBURG, Mitsuru TAMASHIRO