Abstract: A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.

Abstract: A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.

Abstract: The surface panel includes a transmissive resin layer and a sensor film closely attached to a back surface of the resin layer. The sensor film includes a base film, a frame-shaped decorative portion on a front surface of the base film, and a transmissive electrode layer and right and left wiring layers on a back surface of the base film. The sensor film is closely attached to and along the back surface of the resin layer. The right and left wiring layers are closely attached to the corresponding right and back-surface left portions. Consequently, the area that is allocated for the transmissive region and the electrode layer can be increased.

Abstract: In order to provide an electronic circuit board capable of preventing the breakdown voltage of a capacitor element from dropping and excellent in high frequency performance, a positive type photoresist is spin-coated over the surface of an alumina substrate and is exposed to light and developed to form an insulating layer partially, followed by formation of a capacitor element by successively stacking a lower electrode, a dielectric layer and an upper electrode over this insulating layer, further followed by formation of a resistance element, an inductor element and a transmission line, each in a filmy state, over the surface of the alumina substrate.

Abstract: In order to provide an electronic circuit board capable of preventing the breakdown voltage of a capacitor element from dropping and excellent in high frequency performance, a positive type photoresist is spin-coated over the surface of an alumina substrate and is exposed to light and developed to form an insulating layer partially, followed by formation of a capacitor element by successively stacking a lower electrode, a dielectric layer and an upper electrode over this insulating layer, further followed by formation of a resistance element, an inductor element and a transmission line, each in a filmy state, over the surface of the alumina substrate.