Abstract: In a plastic-packaged semiconductor device molded by a synthetic resin, a heat sink is formed by a sheet which has a thermal expansion coefficient between 9.0.times.10.sup.-6 /K and 23.times.10.sup.-6 /K and a thermal conductivity greater than 200 W/m.multidot.K, which are selected in relation to those of the synthetic resin. The sheet is manufactured by mixing a first metal of a high melting point with a second metal of a low melting point lower than the first metal and by pressing and sintering the mixture. The first and the second metal may be molybdenum and copper, respectively. Alternatively, the sheet may be a composite sheet composed of a molybdenum mesh interposed between a pair of aluminum layers or a stacked sheet composed of a sintered layer of a mixture of molybdenum and copper and a coated layer of either molybdenum or copper.

Abstract: A thermal transfer image-receiving sheet having a dye-receiving layer, which is excellent in reaction rate of a release agent, coating Strength of a release layer and releasability from a thermal transfer sheet. The thermal transfer image-receiving sheet comprises a substrate sheet and a dye-receiving layer provided on at least one surface of the substrate sheet, wherein the dye-receiving layer contains a release agent mixture comprising an addition-polymerizable silicone and a hydrogen-modified silicone or wherein the dye-receiving layer has on its surface a release layer comprising an addition-polymerizable silicone and a hydrogen-modified silicone. The present invention relates also to a process for producing the above thermal transfer image-receiving sheets.

Abstract: The present invention provides a thermal mimeograph paper having a point-bonded structure and including a porous backing material and a thermoplastic resin film layer laminated on one side thereof through an adhesive, wherein the porous backing material and the thermoplastic resin film are bonded together by dotwise point bonding. This point-bonded structure enables the perforability of the mimeograph paper to be improved.

Abstract: The heat-sensitive stencil sheet of the present invention is a heat-sensitive stencil sheet including a thermoplastic film (3) laminated through an adhesive layer (2) on one surface of a porous base (1). The adhesive layer includes an ionizing-radiation-curable adhesive, and therefore the above porous support (1) and the thermoplastic film (3) can be rapidly and firmly adhered together, and yet printing resistance during printing can be improved simultaneously with the additional excellent effect of making the printed image sharper.

Abstract: There is disclosed an electric blower assembly provided with an air guide structure designed such that the current of air expelled from a rotating impeller under the influence of centrifugal force is guided to the body of an electric motor while being accelerated. The air guide structure comprises an air guide block having front and rear compartments. The front compartment includes a plurality of volute chambers designed such that, during flow of air within the volute chambers, the dynamic pressure can be converted into static pressure. The flow of air under the static pressure is subsequently guided at a relatively low pneumatic velocity into the rear compartment and then into the body of the motor to cool the latter. The air used to cool the motor is thereafter exhausted to the outside of the motor.

Abstract: Disclosed are improvements in and relating to a fluidized-bed type multistage solid-liquid contact apparatus which comprises a contact column incorporating therein a multiplicity of a spaced and horizontal support plates each carrying thereon a fluidized bed of solid particles and having a downcomer for communicating between the upper and lower sides of the plate, a storage tank for the liquid to be treated by contact with said layer of fluidized solid particles in said contact column, a storage tank for receiving the treated liquid and a storage tank for solid particles for use in said layers.