Patents by Inventor Mitsusada Toyama

Mitsusada Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Earth connection device in metal core printed circuit board
    Patent number: 4823235
    Abstract: A device for providing an earth connection in a metal core printed circuit board (2) which is assembled in a shield casing (1) and which has an earth pattern (23) and a metal core (21), includes conductive connecting members (3) having one end soldered to the earth pattern (23) and another end in surface contact with the metal core (21) and the shield casing (1).
    Type: Grant
    Filed: October 6, 1987
    Date of Patent: April 18, 1989
    Assignee: Fujitsu Limited
    Inventors: Mitsuaki Suzuki, Katsuyuki Arai, Yasushi Kojima, Mitsusada Toyama, Jun Sakiura, Hisao Hayashi, Hiroshi Yamaji