Patents by Inventor Mitsutada Kaneta

Mitsutada Kaneta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coated stainless steel member
    Patent number: 10081878
    Abstract: The present invention provides a method for producing a coated stainless steel member, comprising: performing Wood's strike nickel plating on a stainless steel substrate, and then performing cationic electrodeposition on a formed Wood's strike nickel plating layer.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: September 25, 2018
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Mitsutada Kaneta, Yasuhiro Arai, Manabu Inoue, Tsutomu Miyadera
  • COATED STAINLESS STEEL MEMBER
    Publication number: 20160305033
    Abstract: The present invention provides a method for producing a coated stainless steel member, comprising: performing Wood's strike nickel plating on a stainless steel substrate, and then performing cationic electrodeposition on a formed Wood's strike nickel plating layer.
    Type: Application
    Filed: June 23, 2016
    Publication date: October 20, 2016
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Mitsutada Kaneta, Yasuhiro Arai, Manabu Inoue, Tsutomu Miyadera
  • COATED STAINLESS STEEL MEMBER
    Publication number: 20130327435
    Abstract: The present invention provides a method for producing a coated stainless steel member, comprising: performing Wood's strike nickel plating on a stainless steel substrate, and then performing cationic electrodeposition on a formed Wood's strike nickel plating layer.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 12, 2013
    Inventors: Mitsutada Kaneta, Yasuhiro Arai, Manabu Inoue, Tsutomu Miyadera
  • Electroless plating solution and plating method with it
    Patent number: 5269838
    Abstract: An electroless plating solution comprises nickel ion, a chelating agent for nickel ion, dimethylamine borane, one or more soluble salts of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid, and an electroless plating method comprises the step of immersing a substrate to be plated in this electroless plating solution for sufficent time period to form a nickel or nickel alloy layer on the substrate. The electroless plating solution has a high bath stability and is capable of forming an excellent thick deposit free from pits and cracks.
    Type: Grant
    Filed: March 12, 1993
    Date of Patent: December 14, 1993
    Assignee: Dipsol Chemicals Co., Ltd.
    Inventors: Manabu Inoue, Mitsutada Kaneta, Junko Ozawa