Abstract: A mounting device of the present disclosure is used in a mounting system including multiple mounting devices that perform a mounting process on a mounting target. The mounting device includes a mounting section configured to pick up a component from a supply section holding the component and perform the mounting process for the component on the mounting target, an inspection section configured to perform an inspection process on the component disposed on the mounting target by using reference information, and a control section configured to, when the reference information is updated after an error in the component subjected to a mounting process prior to the mounting device is detected, cause the inspection section to execute the inspection process using the updated reference information on the component subjected to the mounting process prior to the mounting device.

Abstract: A component mounting system includes multiple component mounting devices lined up in a board conveyance direction, with each component mounting device having an imaging device to capture an image of a board. The component mounting system includes a learning device, an inspection device, and a memory device. The learning device captures a post-component-mounting board image after component mounting, acquires training data based on the captured post-component-mounting board image, and creates learning data using machine learning based on the acquired training data. The inspection device captures a post-component-mounting board image, and performs an inspection of the post-component-mounting board under a first inspection condition or under a second inspection condition having inspection accuracy inferior to that of the first inspection condition by performing component recognition image processing on the captured post-component-mounting board image using the learning data.

Abstract: A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.

Abstract: An allowance setting system, a substrate inspection device, an allowance setting method, and a substrate inspection method that can set an appropriate inspection allowance are provided in which a normal mounting position of electronic component on a component mounting surface of substrate is defined as normal position. A deviation of an actual mounting position of electronic component in a surface direction of the component mounting surface with respect to the normal position is defined as surface direction deviation. A deviation of the actual mounting position of electronic component in a rotation direction within the component mounting surface with respect to normal position is defined as angular deviation. Allowance setting system sets multiple surface direction inspection allowances according to angular deviation for evaluating surface direction deviation in a substrate inspection before reflow.

Abstract: A mounting device of the present disclosure is used in a mounting system including multiple mounting devices that perform a mounting process on a mounting target. The mounting device includes a mounting section configured to pick up a component from a supply section holding the component and perform the mounting process for the component on the mounting target, an inspection section configured to perform an inspection process on the component disposed on the mounting target by using reference information, and a control section configured to, when the reference information is updated after an error in the component subjected to a mounting process prior to the mounting device is detected, cause the inspection section to execute the inspection process using the updated reference information on the component subjected to the mounting process prior to the mounting device.

Abstract: A board work system includes a moving device configured to move over an XY-plane, a lighting device attached to the moving device, a monochromatic camera attached to the moving device, and an image processing device. The image processing device selects one or multiple monochromatic lights based on a target object and, when the image processing device selects one monochromatic light, the image processing device causes the lighting device and the monochromatic camera to capture a monochromatic image of the target object which is illuminated with the one monochromatic light and sets the monochromatic image of the target object as a target object inspection image. When the image processing device selects multiple monochromatic lights, the image processing device captures monochromatic images of the target object illuminated with the monochromatic lights and sets a composite image where the monochromatic images are combined as a target object inspection image.

Abstract: A mounting device includes a mounting section configured to pick up a component from a supply section that holds the component and execute a mounting process of the component on a mounting target, and a control section configured to acquire an inspection result obtained by executing an inspection process on the components placed on the mounting target and to notify an operator of the inspection result indicating that the component is defective at a timing before mounting an inspection resulted mounting component that is turned out to be mountable after the inspection result is determined.

Abstract: The component mounting machine includes a head, a head moving device, an imaging device, and a control device. The control device executes a lower component mounting operation that mounts a lower component on a board, an upper component mounting operation that mounts an upper component on the lower component mounted on the board, and a lower component mounting inspection operation that images the board on which the lower component is mounted, and performs a mounting inspection of the lower component based on a captured image after the lower component mounting operation is performed and before the upper component mounting operation is performed.

Abstract: The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.

Abstract: The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.

Abstract: A mounting inspection device includes a missing component inspection device and a foreign object inspection device. The missing component inspection device is for performing missing component inspection of components mounted on a printed circuit board. The foreign object inspection device is for performing foreign object inspection in which foreign objects on a printed circuit board are inspected with regard to the printed circuit board on which a missing component is detected, based on results of the missing component inspection carried out by the missing component inspection device.

Abstract: A board production state monitoring system including a camera unit that is disposed in a board work machine which carries out predetermined work for a board, that images a progress of the work by using a moving image, and that outputs moving image data; a data operation unit that receives, stores, and displays the moving image data; a trigger factor detection unit that detects at least one of a change factor in which working conditions of the work are changed inside the board work machine and a sign of error occurrence which shows that a working error may occur in the work, as a trigger factor; and an imaging start device for causing the camera unit to start moving image capturing if the trigger factor detection unit detects the trigger factor, and for causing the data operation unit to temporarily store the moving image data, is provided.

Abstract: An image generating apparatus includes: a lighting apparatus that emits illumination light to an imaging area where at least a part of an electronic component is located; an imaging apparatus that images the imaging area irradiated with the illumination light; and an image processing apparatus that processes a captured image obtained by the imaging. The image processing apparatus generates a before-adjustment image based on the captured image, generates an adjusted image by adjusting luminance of the before-adjustment image, and generates an optimal image by setting a difference in average luminance between a designated area and a comparison area in the adjusted image largest.

Abstract: A mounting inspection device having: a missing component inspection device for performing missing component inspection of components mounted on a printed circuit board; and a foreign object inspection device for performing foreign object inspection in which foreign objects on a printed circuit board are inspected with regard to a printed circuit board on which a missing component is detected, based on results of the missing component inspection carried out by the missing component inspection device.

Abstract: A board production state monitoring system including a camera unit that is disposed in a board work machine which carries out predetermined work for a board, that images a progress of the work by using a moving image, and that outputs moving image data; a data operation unit that receives, stores, and displays the moving image data; a trigger factor detection unit that detects at least one of a change factor in which working conditions of the work are changed inside the board work machine and a sign of error occurrence which shows that a working error may occur in the work, as a trigger factor; and an imaging start device for causing the camera unit to start moving image capturing if the trigger factor detection unit detects the trigger factor, and for causing the data operation unit to temporarily store the moving image data, is provided.

Abstract: Disclosed is a method of generating image-processing component data which is used when an image of a component to be mounted by a component mounting apparatus is recognized. The method includes extracting first component shape data from CAD data of the component, measuring second component shape data from an image of the component obtained by an imaging device, and generating image-processing component data based on the first and second component shape data.

Abstract: A component presence/absence judging apparatus judges the presence/absence of components through a registration step and an inspection step. The registration step includes an ante-mounting feature acquisition step, a post-mounting feature acquisition step and a classifier configuration step. At the ante-mounting and post-mounting feature acquisition steps, ante-mounting features and post-mounting features are respectively acquired from an ante-mounting image and a post-mounting image taken at each of predetermined places on an ante-mounting board and a post-mounting board. At the classifier configuration step, a classifier is configured by registering the ante-mounting features and the post-mounting features as training data to a support vector machine.

Abstract: A component presence/absence judging apparatus judges the presence/absence of components through a registration step and an inspection step. The registration step includes an ante-mounting feature acquisition step, a post-mounting feature acquisition step and a classifier configuration step. At the ante-mounting and post-mounting feature acquisition steps, ante-mounting features and post-mounting features are respectively acquired from an ante-mounting image and a post-mounting image taken at each of predetermined places on an ante-mounting board and a post-mounting board. At the classifier configuration step, a classifier is configured by registering the ante-mounting features and the post-mounting features as training data to a support vector machine.

Abstract: An image generating apparatus includes: a lighting apparatus that emits illumination light to an imaging area where at least a part of an electronic component is located; an imaging apparatus that images the imaging area irradiated with the illumination light; and an image processing apparatus that processes a captured image obtained by the imaging. The image processing apparatus generates a before-adjustment image based on the captured image, generates an adjusted image by adjusting luminance of the before-adjustment image, and generates an optimal image by setting a difference in average luminance between a designated area and a comparison area in the adjusted image largest.

Abstract: A component presence/absence judging apparatus judges the presence/absence of components through a registration step and an inspection step. The registration step includes an ante-mounting feature acquisition step, a post-mounting feature acquisition step and a classifier configuration step. At the ante-mounting and post-mounting feature acquisition steps, ante-mounting features and post-mounting features are respectively acquired from an ante-mounting image and a post-mounting image taken at each of predetermined places on an ante-mounting board and a post-mounting board. At the classifier configuration step, a classifier is configured by registering the ante-mounting features and the post-mounting features as training data to a support vector machine.