Patents by Inventor Mitsutoshi Asano
Mitsutoshi Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10040224Abstract: An optical shaping method according to the present invention is an optical shaping method for shaping a three-dimensional structure by repeating a process for forming a cured resin layer 53 by irradiating an optically curing resin liquid 51 with light so that cured resin layers 53 are laminated. The process for forming the cured resin layer 53 includes, while applying a sheet light Ls to the optically curing resin liquid 51, applying a first light beam L1 intersecting the sheet light Ls to this optically curing resin liquid, and thereby forming the cured resin layer 53 in an area where the sheet light Ls intersects the first light beam L1. The irradiation place of the sheet light Ls is moved and the process for forming the cured resin layer 53 is repeated.Type: GrantFiled: December 9, 2014Date of Patent: August 7, 2018Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Ken Saruhashi, Isamu Furukawa, Kunihiro Iwamoto, Konosuke Arata, Mitsutoshi Asano, Kentaro Tsuboi, Tetsuji Ueda, Junichi Ikeda
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Publication number: 20150202805Abstract: An optical shaping method according to the present invention is an optical shaping method for shaping a three-dimensional structure by repeating a process for forming a cured resin layer 53 by irradiating an optically curing resin liquid 51 with light so that cured resin layers 53 are laminated. The process for forming the cured resin layer 53 includes, while applying a sheet light Ls to the optically curing resin liquid 51, applying a first light beam L1 intersecting the sheet light Ls to this optically curing resin liquid, and thereby forming the cured resin layer 53 in an area where the sheet light Ls intersects the first light beam L1. The irradiation place of the sheet light Ls is moved and the process for forming the cured resin layer 53 is repeated.Type: ApplicationFiled: December 9, 2014Publication date: July 23, 2015Inventors: Ken SARUHASHI, Isamu FURUKAWA, Kunihiro IWAMOTO, Konosuke ARATA, Mitsutoshi ASANO, Kentaro TSUBOI, Tetsuji UEDA, Junichi IKEDA
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Patent number: 8286336Abstract: A lead wire insertion device includes a first chuck member and a second chuck member, each of which is separable, and connects a coil terminal of a cassette coil to a terminal of a connection terminal. The first chuck member is divided into the first chuck inner member and a first chuck outer member at a first division position that is inside both ends of a cross section of the coil terminal in a lateral direction, and that is offset from a center of the cross section in the lateral direction. The second chuck member is divided into the second chuck inner member and a second chuck outer member at a second division position that is inside the both ends of the cross section of the coil terminal in the lateral direction, and that is offset from a center of the cross section in the lateral direction.Type: GrantFiled: April 22, 2009Date of Patent: October 16, 2012Assignee: Toyota Jidosha Kabushiki KaishaInventor: Mitsutoshi Asano
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Patent number: 7872559Abstract: A rectangular coil unit 1 is manufactured in such a manner that four wires 2 are simultaneously regularly wound on four outer surfaces of a bobbin 3 having a rectangular section so that the wires 2 advance obliquely together for a lane change corresponding to 0.5 wire on one (a lower surface side) of a pair of parallel surfaces of the four outer surfaces of the bobbin 3 and for a lane change corresponding to 3.5 wires on the other one (an upper surface side) of the parallel surfaces.Type: GrantFiled: November 2, 2006Date of Patent: January 18, 2011Assignee: Toyota Jidosha Kabushiki KaishaInventor: Mitsutoshi Asano
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Patent number: 7868726Abstract: A rectangular coil unit is manufactured in such a manner that two wires are simultaneously regularly wound on four outer surfaces of a bobbin having a rectangular section so that the wires advance obliquely together for a lane change corresponding to 0.5 wire on one (a lower surface side) of a pair of parallel surfaces of the four outer surfaces of the bobbin and for a lane change corresponding to 1.5 wires on the other one (an upper surface side) of the parallel surfaces.Type: GrantFiled: November 2, 2006Date of Patent: January 11, 2011Assignee: Toyota Jidosha Kabushiki KaishaInventor: Mitsutoshi Asano
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Publication number: 20090277001Abstract: A lead wire insertion device includes a first chuck member and a second chuck member, each of which is separable, and connects a coil terminal of a cassette coil to a terminal of a connection terminal. The first chuck member is divided into the first chuck inner member and a first chuck outer member at a first division position that is inside both ends of a cross section of the coil terminal in a lateral direction, and that is offset from a center of the cross section in the lateral direction. The second chuck member is divided into the second chuck inner member and a second chuck outer member at a second division position that is inside the both ends of the cross section of the coil terminal in the lateral direction, and that is offset from a center of the cross section in the lateral direction.Type: ApplicationFiled: April 22, 2009Publication date: November 12, 2009Inventor: Mitsutoshi ASANO
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Patent number: 7614579Abstract: A winding apparatus comprises first and second nozzles, each of which is configured to allow two wires to pass therethrough, and a nozzle holder which holds the nozzles in parallel with each other. A total of four wires is supplied and regularly wound on a bobbin. A first motor, a driven gear, and a drive gear are provided to rotate the nozzle holder about its axis substantially parallel to the nozzles. The nozzle holder holds the nozzles separately to be rotatable about respective axes. Second and third motors, driven gears, and drive gears are provided for rotating the nozzles about respective axes.Type: GrantFiled: November 2, 2006Date of Patent: November 10, 2009Assignee: Toyota Jidosha Kabushiki KaishaInventor: Mitsutoshi Asano
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Publication number: 20090179725Abstract: A rectangular coil unit 1 is manufactured in such a manner that four wires 2 are simultaneously regularly wound on four outer surfaces of a bobbin 3 having a rectangular section so that the wires 2 advance obliquely together for a lane change corresponding to 0.5 wire on one (a lower surface side) of a pair of parallel surfaces of the four outer surfaces of the bobbin 3 and for a lane change corresponding to 3.5 wires on the other one (an upper surface side) of the parallel surfaces.Type: ApplicationFiled: November 2, 2006Publication date: July 16, 2009Inventor: Mitsutoshi Asano
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Publication number: 20090167475Abstract: A rectangular coil unit is manufactured in such a manner that two wires are simultaneously regularly wound on four outer surfaces of a bobbin having a rectangular section so that the wires advance obliquely together for a lane change corresponding to 0.5 wire on one (a lower surface side) of a pair of parallel surfaces of the four outer surfaces of the bobbin and for a lane change corresponding to 1.5 wires on the other one (an upper surface side) of the parallel surfaces.Type: ApplicationFiled: November 2, 2006Publication date: July 2, 2009Inventor: Mitsutoshi Asano
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Publication number: 20090159736Abstract: A winding apparatus comprises first and second nozzles, each of which is configured to allow two wires to pass therethrough, and a nozzle holder which holds the nozzles in parallel with each other. A total of four wires is supplied and regularly wound on a bobbin. A first motor, a driven gear, and a drive gear are provided to rotate the nozzle holder about its axis substantially parallel to the nozzles. The nozzle holder holds the nozzles separately to be rotatable about respective axes. Second and third motors, driven gears, and drive gears are provided for rotating the nozzles about respective axes.Type: ApplicationFiled: November 2, 2006Publication date: June 25, 2009Inventor: Mitsutoshi Asano
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Publication number: 20030145948Abstract: A electronic component fixing method comprising: (a) applying first conductive bonding agent (3) onto first lands of a circuit board; (b) disposing first electronic component (2) on the first conductive bonding agent, followed by melting and hardening the first conductive bonding agent to bond and fix electrodes of the first electronic component on the first land; (c) fixing the first electronic component on the board by non-conductive adhesive (5); and (d) bonding and fixing electrodes of second electronic component on second lands of the board by second conductive bonding agent. Further, in one preferred embodiment, a melting temperature of the second conductive bonding agent is not less than a melting temperature of the first conductive bonding agent. According to the present invention, no accurate control of a position of application of the non-conductive adhesive is needed, making it very easy to perform the electronic component fixing operation.Type: ApplicationFiled: December 18, 2002Publication date: August 7, 2003Inventors: Mitsutoshi Asano, Masami Yamamura