Abstract: A high projection is provided outside the bottom surface of a cap and a low and small protrusion is provided inside the projection. The projection is resistance-welded to a stem by allowing the projection to abut the stem so as to supply an electric current thereto. Even if melt particles flow inwardly, they are blocked by the small protrusion arranged inside so as not to enter the internal space, thereby eliminating a tapping test of an optical device and an optical module.

Abstract: Optoelectronic properties of optical communication LEDs, LDs and PDs should be examined in a wide range of temperatures between ?40° C. and +85° C. Low temperature photocharacteristics of as-chip devices are tested by preparing an inspection stage cooled at a low temperature encapsulated in a shield casing with a front opening, conveying a chip of LD, LED or PD by a collet via the opening, placing the chip on the cold stage, blowing the stage and chip with cool dry air for preventing the chip from wetting, touching the chip by a probe, applying a current/voltage to the chip, examining emission/detection of the chip and taking the chip off via the opening by the collet.

Abstract: Optoelectronic properties of optical communication LEDs, LDs and PDs should be examined in a wide range of temperatures between ?40° C. and +85° C. Low temperature photocharacteristics of as-chip devices are tested by preparing an inspection stage cooled at a low temperature encapsulated in a shield casing with a front opening, conveying a chip of LD, LED or PD by a collet via the opening, placing the chip on the cold stage, blowing the stage and chip with cool dry air for preventing the chip from wetting, touching the chip by a probe, applying a current/voltage to the chip, examining emission/detection of the chip and taking the chip off via the opening by the collet.

Abstract: In a conventional resistance welding-use electrode, a foot portion at the end is divided into three segments. An object such as a cap is inserted into a hole at the end. The foot portion is bent inward to hold the object by a force, and the object (cap) is pressed to a stem. Under this condition, a current is fed to perform resistance welding. A gap remains between the individual segments of the foot portion. Therefore, the current density is uneven, producing unevenness in the welding. A soft object may deform. The electrode wears and deforms due to repeated use, reducing its useful life. Because of the existence of the gap, pressing marks are sometimes formed in the welded portion. In the present invention, a permanent magnet is embedded at the end portion of the electrode to hold the object by magnetic force of the permanent magnet.

Abstract: In the foreign object insertion detector device, the light (infrared rays) is transmitted into the internal space 13 of a tube body 11 implanted into a weather strip 9 and formed of elastic material and, if there occurs the insertion of a foreign object, then the foreign object produces a pressing force and applies the pressing force to the tube body 11 to thereby deform the tube body 11. If the tube body 11 is deformed in this manner, then the quantity of the light transmitted through the internal space 13 is caused to decrease. By judging whether a decrease in the quantity of the light transmitted through the internal space 13 is present or absent, the insertion of the foreign object can be detected.

Abstract: A rear surface emission type light emitting diode emits light beams produced at a narrow emanating region out of the rear surface of the substrate. Preferably a device chip should be directly equipped with a lens on the rear surface. A plurality of light emitting devices with a package are laid on an XY-stage which can move in an XY-plane. A camera, a dispenser and a vacuum collet can transfer in Z-direction. The distances and the directions among the camera, the dispenser and the collet are predetermined values. The chip is actually examined by letting it emit light beams from the emanating region. The light is observed by the camera to obtain light power distribution on individual pixels. From the light power, the center of the emanating region is determined. The XY-stage is displaced till the center of the emanating region coincides with the center of the camera. Then the XY-stage is moved by the predetermined distance to send the chip just beneath the dispenser.

Abstract: The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in the dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Abstract: The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in tile dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.