Patents by Inventor Mitsutoshi Miyazaki
Mitsutoshi Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072367Abstract: An external connection bus bar to be connected to a storage element group having a plurality of storage elements and having an output electrode terminal for outputting electric power to an external circuit includes a main body portion to be connected to the output electrode terminal, an external connection terminal to be connected to an external circuit, and a circuit board connection portion to be soldered to a bus bar land provided on the circuit board. The external connection terminal is provided between the main body portion and the circuit board connection portion.Type: ApplicationFiled: December 28, 2021Publication date: February 29, 2024Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shuya IKEDA, Osamu NAKAYAMA, Katsushi MIYAZAKI, Mitsutoshi MORITA
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Patent number: 7080445Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.Type: GrantFiled: October 31, 2002Date of Patent: July 25, 2006Assignee: Denso CorporationInventors: Toshihiro Miyake, Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani, Akinari Higashida, Hiroki Miyagawa
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Patent number: 6732621Abstract: An improved method of machining slots and material feed holes in a molding die such as an extrusion die designed to form a honeycomb structure of ceramics employed as a catalyst carrier of a catalytic converter for automotive vehicles. In one of the preferred embodiments, shallow holes are drilled in a die material and subjected to electrochemical machining to remove material from the bottoms of the shallow holes so that they communicate with the material feed holes without any burrs. In the other embodiment, the slots are cut using a rotary cutter in a given order which will balance reaction forces exerted on the cutter from both side walls of each slot to minimize deformation of the cutter during cutting of the slots, thereby preventing the slots from being curved undesirably.Type: GrantFiled: July 13, 2001Date of Patent: May 11, 2004Assignee: Denso CorporationInventors: Naoto Iwata, Masayoshi Fujita, Masahiko Natume, Yoshiaki Mizuno, Mitsutoshi Miyazaki, Toshiji Kondou
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Patent number: 6651726Abstract: A method of attaching a mold releasing agent to a molding die, a molding apparatus and a molding die therefor are disclosed. A fixed die (11) of the molding die (1) is connected to the nozzle receiving surface of a molding cavity (10) facing a material supplying nozzle. The mold releasing agent is attached to the material contacting surface (100) of the molding die (1) in such a manner that the fixed die (11) and a movable die (12) are arranged in opposed relation to each other with a gap therebetween less than a distance which allows release of a molded product, and under this condition, the mold releasing agent is supplied to the material contacting surface (100) through the gap between the material supplying nozzle (31) and the nozzle receiving surface (131).Type: GrantFiled: July 27, 2001Date of Patent: November 25, 2003Assignee: Denso CorporationInventors: Hideyuki Suzuki, Koichiro Sato, Mitsutoshi Miyazaki
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Patent number: 6641385Abstract: A metal mold for molding a hexagonal honeycomb structure, having feed holes for feeding a material, pool grooves formed in the shape of a triangular lattice and communicated with the feed holes, and slit grooves formed in the shape of a hexagonal lattice and communicated with the pool grooves. Each hexagonal lattice of the slit grooves is so formed as to come into agreement with a hexagon shaped by combining six triangular lattices of the pool grooves.Type: GrantFiled: June 24, 2002Date of Patent: November 4, 2003Assignee: Denso CorporationInventors: Masayoshi Fujita, Mitsutoshi Miyazaki, Yosiyasu Andou
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Publication number: 20030079341Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.Type: ApplicationFiled: October 31, 2002Publication date: May 1, 2003Inventors: Toshihiro Miyake, Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani, Akinari Higashida, Hiroki Miyagawa
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Publication number: 20020153356Abstract: A metal mold for molding a hexagonal honeycomb structure, having feed holes for feeding a material, pool grooves formed in the shape of a triangular lattice and communicated with the feed holes, and slit grooves formed in the shape of a hexagonal lattice and communicated with the pool grooves. Each hexagonal lattice of the slit grooves is so formed as to come into agreement with a hexagon shaped by combining six triangular lattices of the pool grooves. The invention is further concerned to a method of producing a metal mold for molding a hexagonal honeycomb structure, having feed holes for feeding a material, pool grooves formed in the shape of a triangular lattice, and slit grooves formed in the shape of a hexagonal lattice.Type: ApplicationFiled: June 24, 2002Publication date: October 24, 2002Applicant: DENSO CORPORATIONInventors: Masayoshi Fujita, Mitsutoshi Miyazaki, Yosiyasu Andou
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Publication number: 20020011691Abstract: A method of attaching a mold releasing agent to a molding die, a molding apparatus and a molding die therefor are disclosed. A fixed die (11) of the molding die (1) is connected to the nozzle receiving surface of a molding cavity (10) facing a material supplying nozzle. The mold releasing agent is attached to the material contacting surface (100) of the molding die (1) in such a manner that the fixed die (11) and a movable die (12) are arranged in opposed relation to each other with a gap therebetween less than a distance which allows release of a molded product, and under this condition, the mold releasing agent is supplied to the material contacting surface (100) through the gap between the material supplying nozzle (31) and the nozzle receiving surface (131).Type: ApplicationFiled: July 27, 2001Publication date: January 31, 2002Inventors: Hideyuki Suzuki, Koichiro Sato, Mitsutoshi Miyazaki
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Publication number: 20010045366Abstract: An improved method of machining slots and material feed holes in a molding die such as an extrusion die designed to form a honeycomb structure of ceramics employed as a catalyst carrier of a catalytic converter for automotive vehicles. In one of the preferred embodiments, shallow holes are drilled in a die material and subjected to electrochemical machining to remove material from the bottoms of the shallow holes so that they communicate with the material feed holes without any burrs. In the other embodiment, the slots are cut using a rotary cutter in a given order which will balance reaction forces exerted on the cutter from both side walls of each slot to minimize deformation of the cutter during cutting of the slots, thereby preventing the slots from being curved undesirably.Type: ApplicationFiled: July 13, 2001Publication date: November 29, 2001Inventors: Naoto Iwata, Masayoshi Fujita, Masahiko Natume, Yoshiaki Mizuno, Mitsutoshi Miyazaki, Toshiji Kondou
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Patent number: 6290837Abstract: An improved method of machining slots and material feed holes in a molding die such as an extrusion die designed to form a honeycomb structure of ceramics employed as a catalyst carrier of a catalytic converter for automotive vehicles. In one of the preferred embodiments, shallow holes are drilled in a die material and subjected to electrochemical machining to remove material from the bottoms of the shallow holes so that they communicate with the material feed holes without any burrs. In the other embodiment, the slots are cut using a rotary cutter in a given order which will balance reaction forces exerted on the cutter from both side walls of each slot to minimize deformation of the cutter during cutting of the slots, thereby preventing the slots from being curved undesirably.Type: GrantFiled: June 9, 1998Date of Patent: September 18, 2001Assignee: Denso CorporationInventors: Naoto Iwata, Nobuhiko Nagai, Mitsutoshi Miyazaki, Kunihiro Kodama