Abstract: An object of this invention is to provide a thermoelectric apparatus, which is excellent in performance and has sufficiently high thermoelectric conversion ability.Supply means 6,7 for supplying a liquid heat transfer medium 21 against a side of a substrate with N-type semiconductor layers and P-type semiconductor layers supported thereon, said side being opposite to a semiconductor-layer-supporting side of the substrate, is arranged so that the liquid heat transfer medium 21 strikes against the opposite side of the substrate.

Abstract: A thermoelectric apparatus is composed of a heat-absorbing-side heat-exchanging base and a heat-dissipating-side heat-exchanging base having good thermal conductivity and arranged in a mutually opposing relationship with a group of thermoelectric elements interposed therebetween. The thermoelectric apparatus comprises a frame made of a synthetic resin material and holding one of the heat-absorbing-side heat-exchanging base and the heat-dissipating-side heat-exchanging base at an outer peripheral portion thereof. The frame and the other heat-exchanging base, which is not held by the frame, are both provided with extended portions extending substantially along and substantially in the same direction as a stacked direction of the heat-absorbing-side heat-exchanging base, the group of thermoelectric elements and the heat-dissipating-side heat-exchanging base. The extended portions are joined together.

Abstract: One of a heat-absorbing-side thermal conductor and a heat-dissipating-side thermal conductor is substantially in a form of a single piece. Plural groups of thermoelectric elements are arranged relative to the single-piece thermal conductor. Corresponding to the plural groups of thermoelectric elements, the other one of the heat-absorbing-side thermal conductor and the heat-dissipating-side thermal conductor is arranged in a form divided into a like number of pieces.