Patents by Inventor Mitsuyasu Furusawa

Mitsuyasu Furusawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11446752
    Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 20, 2022
    Assignee: KOKI Company Limited
    Inventors: Satoshi Ootani, Mitsuyasu Furusawa
  • Patent number: 11447626
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 20, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Patent number: 11425825
    Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: August 23, 2022
    Assignee: KOKI Company Limited
    Inventors: Yuki Yamamoto, Satoshi Ootani, Mitsuyasu Furusawa
  • Publication number: 20210260679
    Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
    Type: Application
    Filed: October 1, 2019
    Publication date: August 26, 2021
    Inventors: Satoshi OOTANI, Mitsuyasu FURUSAWA
  • Patent number: 10888960
    Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 12, 2021
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Mitsuyasu Furusawa, Kimiaki Mori
  • Publication number: 20200398383
    Abstract: The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.
    Type: Application
    Filed: March 8, 2019
    Publication date: December 24, 2020
    Inventors: Arisa SHIRAISHI, Naoto OZAWA, Takayuki SUZUKI, Mitsuyasu FURUSAWA
  • Publication number: 20200325326
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Application
    Filed: November 1, 2018
    Publication date: October 15, 2020
    Applicant: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Patent number: 10702956
    Abstract: Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(?O)—R4, and —O—C(?O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: July 7, 2020
    Assignee: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Yuusuke Sato, Junichi Aoki, Mitsuyasu Furusawa, Kimiaki Mori
  • Publication number: 20200187363
    Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.
    Type: Application
    Filed: October 2, 2017
    Publication date: June 11, 2020
    Applicant: KOKI Company Limited
    Inventor: Mitsuyasu FURUSAWA
  • Patent number: 10610981
    Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 7, 2020
    Assignees: ORIGIN COMPANY, LIMITED, KOKI COMPANY LIMITED
    Inventors: Yukiko Hayashi, Arisa Shiraishi, Naoto Ozawa, Takayuki Suzuki, Takeshi Shirai, Noriyoshi Uchida, Mitsuyasu Furusawa
  • Publication number: 20190184500
    Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
    Type: Application
    Filed: September 30, 2016
    Publication date: June 20, 2019
    Inventors: Kazuhiro YUKIKATA, Mitsuyasu FURUSAWA, Kimiaki MORI
  • Publication number: 20190182966
    Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.
    Type: Application
    Filed: August 2, 2017
    Publication date: June 13, 2019
    Inventors: Yuki YAMAMOTO, Satoshi OOTANI, Mitsuyasu FURUSAWA
  • Publication number: 20190009375
    Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
    Type: Application
    Filed: September 29, 2016
    Publication date: January 10, 2019
    Inventors: Yukiko HAYASHI, Arisa SHIRAISHI, Naoto OZAWA, Takayuki SUZUKI, Takeshi SHIRAI, Noriyoshi UCHIDA, Mitsuyasu FURUSAWA
  • Publication number: 20180015576
    Abstract: Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(?O)—R4, and —O—C(?O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.
    Type: Application
    Filed: February 5, 2016
    Publication date: January 18, 2018
    Inventors: Kazuhiro Yukikata, Yuusuke Sato, Junichi Aoki, Mitsuyasu Furusawa, Kimiaki Mori
  • Patent number: 9609762
    Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 28, 2017
    Assignee: KOKI Company Limited
    Inventors: Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Mayumi Takada, Munehiko Nakatsuma
  • Publication number: 20150102090
    Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
    Type: Application
    Filed: March 11, 2013
    Publication date: April 16, 2015
    Inventors: Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Mayumi Takada, Munehiko Nakatsuma
  • Patent number: 7606454
    Abstract: An optical fiber array for insertion-positioning and arranging coated optical fibers in a substrate, in which a plurality of through-holes are formed, wherein a coating of a tip of the coated optical fiber is removed to expose a optical fiber, and wherein with the use of three substrates, the optical fiber of the coated optical fiber is inserted into through-holes of the first and second substrates and is positioned, and the coating of the coated optical fiber is inserted into a through-hole of the third substrate and is positioned.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: October 20, 2009
    Assignee: Hitachi Metals, Ltd.
    Inventor: Mitsuyasu Furusawa
  • Publication number: 20070201807
    Abstract: An optical fiber array for insertion-positioning and arranging coated optical fibers in a substrate, in which a plurality of through-holes are formed, wherein a coating of a tip of the coated optical fiber is removed to expose a optical fiber, and wherein with the use of three substrates, the optical fiber of the coated optical fiber is inserted into through-holes of the first and second substrates and is positioned, and the coating of the coated optical fiber is inserted into a through-hole of the third substrate and is positioned.
    Type: Application
    Filed: February 23, 2007
    Publication date: August 30, 2007
    Inventor: Mitsuyasu FURUSAWA