Patents by Inventor Mitsuyo Kariya

Mitsuyo Kariya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Focused ion beam deposition using TMCTS
    Patent number: 5639699
    Abstract: According to this invention, there is provided a method of repairing a bump defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of forming a first thin film consisting of a material different from that of the substrate on the substrate around the bump defect or close to the bump defect, forming a second thin film on the bump defect and the first thin film to flatten an upper surface of the second thin film, performing simultaneous removal of the bump defect and the thin films on an upper portion of the projecting defect and around the bump defect using a charged particle beam, and performing removal of the thin films left in the step of performing simultaneous removal.
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: June 17, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroko Nakamura, Haruki Komano, Kazuyoshi Sugihara, Keiji Horioka, Mitsuyo Kariya, Soichi Inoue, Ichiro Mori, Katsuya Okumura, Tadahiro Takigawa, Toru Watanabe, Motosuke Miyoshi, Yuichiro Yamazaki, Haruo Okano
  • Method of repairing defect of structure
    Patent number: 5429730
    Abstract: According to this invention, there is provided a method of repairing a bump defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of forming a first thin film consisting of a material different from that of the substrate on the substrate around the bump defect or close to the bump defect, forming a second thin film on the bump defect and the first thin film to flatten an upper surface of the second thin film, performing simultaneous removal of the bump defect and the thin films on an upper portion of the projecting defect and around the bump defect using a charged particle beam, and performing removal of the thin films left in the step of performing simultaneous removal.
    Type: Grant
    Filed: November 2, 1993
    Date of Patent: July 4, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroko Nakamura, Haruki Komano, Kazuyoshi Sugihara, Keiji Horioka, Mitsuyo Kariya, Soichi Inoue, Ichiro Mori, Katsuya Okumura, Tadahiro Takigawa, Toru Watanabe, Motosuke Miyoshi, Yuichiro Yamazaki, Haruo Okano