Patents by Inventor Mitsuyoshi Hira
Mitsuyoshi Hira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10707830Abstract: An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.Type: GrantFiled: December 13, 2016Date of Patent: July 7, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Taku Kikuchi, Seiji Kai, Motoji Tsuda, Mitsuyoshi Hira
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Patent number: 10644669Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.Type: GrantFiled: May 1, 2019Date of Patent: May 5, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Mitsuyoshi Hira, Seiji Kai
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Patent number: 10637431Abstract: An electronic component includes a functional electrode provided on a first substrate that has a rectangular or substantially rectangular plate shape and a support layer including resin that surrounds the functional electrode. A cover member closes an opening of the support layer. A via conductor penetrating the support layer is provided in at least one corner portion of the support layer. A resin reinforcing portion having the same height or substantially the same height as the support layer is provided in an outer side portion of the corner portion provided with the via conductor.Type: GrantFiled: October 11, 2016Date of Patent: April 28, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Mitsuyoshi Hira, Taku Kikuchi
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Patent number: 10622965Abstract: A surface acoustic wave device assembly includes a collective board, first circuit portions provided on the collective board and respectively including first hot terminals and first ground terminals, a second circuit portion provided on the collective board and including second hot terminals and second ground terminals, and a power supply wiring provided on the collective board so as to surround the periphery of the first circuit portions and the second circuit portion. The first circuit portions include surface acoustic wave devices defining band pass filters. The second circuit portion defines a band pass filter. The first ground terminals and first hot terminals, and the second ground terminal are connected to the power supply wiring, the second hot terminals are not connected to the power supply wiring, and pass bands of the surface acoustic wave devices and a pass band of the band pass filter defined by the second circuit portion are the same or substantially the same.Type: GrantFiled: July 17, 2017Date of Patent: April 14, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Toru Takeshita, Seiji Kai, Takashi Naka, Motoji Tsuda, Mitsuyoshi Hira
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Publication number: 20190260341Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.Type: ApplicationFiled: May 1, 2019Publication date: August 22, 2019Inventors: Mitsuyoshi HIRA, Seiji KAI
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Patent number: 10320355Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.Type: GrantFiled: May 6, 2015Date of Patent: June 11, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Hira, Seiji Kai
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Patent number: 9978929Abstract: An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member.Type: GrantFiled: February 11, 2015Date of Patent: May 22, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Hira, Motoji Tsuda
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Patent number: 9876484Abstract: In an elastic wave device, a plurality of elastic wave elements that include IDT electrodes are provided on a piezoelectric substrate, and a support layer that surrounds the elastic wave elements is provided on the piezoelectric substrate to define hollow portions in which the elastic wave elements are located. A cover member is stacked on the support layer, so that the hollow portions, in which the elastic wave elements are located, are provided, and the support layer includes a first support layer and a second support layer. The first support layer extends along an outer peripheral edge of the piezoelectric substrate, and the second support layer is located in a region surrounded by the first support layer and disposed around the elastic wave elements so as to have the hollow portions, in which the elastic wave elements are located. A hollow path is provided between the first support layer and the second support layer and arranged to allow communication between at least two of the hollow portions.Type: GrantFiled: February 1, 2016Date of Patent: January 23, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Hira, Seiji Kai
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Publication number: 20170317659Abstract: A surface acoustic wave device assembly includes a collective board, first circuit portions provided on the collective board and respectively including first hot terminals and first ground terminals, a second circuit portion provided on the collective board and including second hot terminals and second ground terminals, and a power supply wiring provided on the collective board so as to surround the periphery of the first circuit portions and the second circuit portion. The first circuit portions include surface acoustic wave devices defining band pass filters. The second circuit portion defines a band pass filter. The first ground terminals and first hot terminals, and the second ground terminal are connected to the power supply wiring, the second hot terminals are not connected to the power supply wiring, and pass bands of the surface acoustic wave devices and a pass band of the band pass filter defined by the second circuit portion are the same or substantially the same.Type: ApplicationFiled: July 17, 2017Publication date: November 2, 2017Inventors: Toru TAKESHITA, Seiji KAI, Takashi NAKA, Motoji TSUDA, Mitsuyoshi HIRA
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Patent number: 9748919Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, and a cover member. The IDT electrode is provided on the piezoelectric substrate. The cover member is provided above the piezoelectric substrate and separate from the IDT electrode. The cover member includes a first cover member and a second cover member. The second cover member is laminated on a side of the first cover member opposite to the piezoelectric substrate. The glass transition point of the first cover member is higher than that of the second cover member.Type: GrantFiled: April 29, 2015Date of Patent: August 29, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Hira, Motoji Tsuda
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Publication number: 20170093366Abstract: An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.Type: ApplicationFiled: December 13, 2016Publication date: March 30, 2017Applicant: Murata Manufacturing Co., Ltd.Inventors: Taku Kikuchi, Seiji KAI, Motoji TSUDA, Mitsuyoshi HIRA
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Publication number: 20170033763Abstract: An electronic component includes a functional electrode provided on a first substrate that has a rectangular or substantially rectangular plate shape and a support layer including resin that surrounds the functional electrode. A cover member closes an opening of the support layer. A via conductor penetrating the support layer is provided in at least one corner portion of the support layer. A resin reinforcing portion having the same height or substantially the same height as the support layer is provided in an outer side portion of the corner portion provided with the via conductor.Type: ApplicationFiled: October 11, 2016Publication date: February 2, 2017Inventors: Mitsuyoshi HIRA, Taku KIKUCHI
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Publication number: 20160149557Abstract: In an elastic wave device, a plurality of elastic wave elements that include IDT electrodes are provided on a piezoelectric substrate, and a support layer that surrounds the elastic wave elements is provided on the piezoelectric substrate to define hollow portions in which the elastic wave elements are located. A cover member is stacked on the support layer, so that the hollow portions, in which the elastic wave elements are located, are provided, and the support layer includes a first support layer and a second support layer. The first support layer extends along an outer peripheral edge of the piezoelectric substrate, and the second support layer is located in a region surrounded by the first support layer and disposed around the elastic wave elements so as to have the hollow portions, in which the elastic wave elements are located. A hollow path is provided between the first support layer and the second support layer and arranged to allow communication between at least two of the hollow portions.Type: ApplicationFiled: February 1, 2016Publication date: May 26, 2016Inventors: Mitsuyoshi HIRA, Seiji KAI
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Patent number: 9271400Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.Type: GrantFiled: September 3, 2013Date of Patent: February 23, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Seiji Kai, Shintaro Nakatani, Mitsuyoshi Hira, Takao Mukai, Hisashi Yamazaki
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Patent number: 9197192Abstract: An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.Type: GrantFiled: August 30, 2013Date of Patent: November 24, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Syuji Yamato, Mitsuyoshi Hira
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Publication number: 20150249438Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, and a cover member. The IDT electrode is provided on the piezoelectric substrate. The cover member is provided above the piezoelectric substrate and separate from the IDT electrode. The cover member includes a first cover member and a second cover member. The second cover member is laminated on a side of the first cover member opposite to the piezoelectric substrate. The glass transition point of the first cover member is higher than that of the second cover member.Type: ApplicationFiled: April 29, 2015Publication date: September 3, 2015Inventors: Mitsuyoshi HIRA, Motoji TSUDA
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Publication number: 20150243875Abstract: An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member.Type: ApplicationFiled: February 11, 2015Publication date: August 27, 2015Inventors: Mitsuyoshi HIRA, Motoji TSUDA
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Publication number: 20150236237Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.Type: ApplicationFiled: May 6, 2015Publication date: August 20, 2015Inventors: Mitsuyoshi HIRA, Seiji KAI
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Publication number: 20140003017Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.Type: ApplicationFiled: September 3, 2013Publication date: January 2, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Seiji KAI, Shintaro NAKATANI, Mitsuyoshi HIRA, Takao MUKAI, Hisashi YAMAZAKI
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Publication number: 20130335171Abstract: An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.Type: ApplicationFiled: August 30, 2013Publication date: December 19, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Syuji YAMATO, Mitsuyoshi HIRA