Patents by Inventor Mitsuyoshi Hirayama

Mitsuyoshi Hirayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of joining metallic members, and joined metallic members
    Patent number: 6220501
    Abstract: Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: April 24, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiro Tadauchi, Izuru Komatsu, Kouichi Teshima, Rikiya Katoh, Jun Sugimoto, Takayuki Suzuki, Mitsuyoshi Hirayama