Patents by Inventor Mitsuyoshi Matsuda

Mitsuyoshi Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9663868
    Abstract: An object of the present invention is to provide an electro-deposited copper-alloy foil excellent in infrared laser processability which enables uniform etching rate along a thickness direction in following etching process. To achieve the object, an electro-deposited copper-alloy foil obtained from electrolyzing of an electrolytic solution, wherein the electro-deposited copper-alloy foil has tin content of 8% by mass to 25% by mass is employed. In the electro-deposited copper-alloy foil, a grain in a crystal structure is preferably a columnar grain longitudinal along a thickness direction.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: May 30, 2017
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Mitsuyoshi Matsuda, Kazuhiro Yoshikawa, Takao Fujimoto
  • Patent number: 9338898
    Abstract: A method-of producing a printed wiring board comprises: forming a via-hole for interlayer connection in a laminate in which a copper foil for laser processing comprises a copper foil and an easily soluble laser absorption layer provided on a surface of the copper foil which has a higher etching rate to a copper etchant than the copper foil and absorbs an infrared laser beam and another conductor layer is laminated through an insulating layer, directly irradiating the infrared laser beam on the easily soluble laser absorption layer; and removing the easily soluble laser absorption layer from the surface of the copper foil in a desmear step of removing a smear in a via-hole and/or a microetching step as a pretreatment of an electroless plating step is adopted.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: May 10, 2016
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Joji Fujii, Hiroaki Tsuyoshi, Hiroto Iida, Kazuhiro Yoshikawa, Mitsuyoshi Matsuda
  • Patent number: 9307639
    Abstract: Present invention provides an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. The electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm2 to 100 kgf/mm2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: April 5, 2016
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Hisao Sakai, Masaru Takahashi, Mitsuyoshi Matsuda, Makoto Dobashi
  • Patent number: 9077827
    Abstract: In order to provide a page-turning reader device and a feeder device capable of continuously acquiring image data of each page of a plurality of booklets, the page-turning reader device (1) includes a feeder unit (102) that feeds a plurality of stacked booklets (10) one by one from a lower side; a holder (203) that grips and fixes a binding edge of the booklet (10) fed from the feeder unit (102); an air suction pad (206), an air blow nozzle (207), and a first page-turning bar (204) configured to turn the pages of the booklet (10) one by one while the booklet (10) is fixed by the holder (203); and an image data acquiring means (11) that acquires image data of each page of the booklet (10) using an image pickup camera (106) in synchronization with a turning operation.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: July 7, 2015
    Assignee: Cosmograph Inc.
    Inventors: Mitsuyoshi Matsuda, Norichika Hirohashi, Naoki Komuro, Yutaka Sasaki
  • Publication number: 20140268257
    Abstract: In order to provide a page-turning reader device and a feeder device capable of continuously acquiring image data of each page of a plurality of booklets, the page-turning reader device (1) includes a feeder unit (102) that feeds a plurality of stacked booklets (10) one by one from a lower side; a holder (203) that grips and fixes a binding edge of the booklet (10) fed from the feeder unit (102); an air suction pad (206), an air blow nozzle (207), and a first page-turning bar (204) configured to turn the pages of the booklet (10) one by one while the booklet (10) is fixed by the holder (203); and an image data acquiring means (11) that acquires image data of each page of the booklet (10) using an image pickup camera (106) in synchronization with a turning operation.
    Type: Application
    Filed: May 22, 2012
    Publication date: September 18, 2014
    Inventors: Mitsuyoshi Matsuda, Norichika Hirohashi, Naoki Komuro, Yutaka Sasaki
  • Patent number: 8722199
    Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: May 13, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Mitsuyoshi Matsuda, Hisao Sakai, Sakiko Tomonaga, Makoto Dobashi
  • Patent number: 8715836
    Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: May 6, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
  • Publication number: 20130247373
    Abstract: An object of the present invention is to provide a method of producing a printed wiring board which reduces production steps, is excellent in infrared laser processability, and is suitable for formation of an excellent wiring pattern; and to provide a copper foil for laser processing and a copper-clad laminate.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 26, 2013
    Inventors: Joji FUJII, Hiroaki TSUYOSHI, Hiroto IIDA, Kazuhiro YOSHIKAWA, Mitsuyoshi MATSUDA
  • Patent number: 8457506
    Abstract: An image-forming device includes a main casing, a drum unit, an image-forming unit, and a transfer unit. The drum unit is detachable from the main casing and includes a photosensitive drum having a rotational axis extending in an axis direction. The drum unit is formed with a plurality of symbols juxtaposed along the axis direction. The image-forming unit forms an image on the photosensitive drum in an image-forming mode. The transfer unit transfers the first developer image onto the photosensitive drum onto a sheet. The image-forming unit forms a first developer image on the photosensitive drum in a maintenance mode. The first developer image transferred onto the sheet divides the sheet into a plurality of regions along the axis direction, the plurality of regions corresponding to the plurality of symbols, respectively.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: June 4, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Koji Abe, Takashi Shimizu, Haruyo Endo, Yoshiki Mori, Jun Hatta, Shinji Ogawa, Mitsuyoshi Matsuda
  • Patent number: 8419920
    Abstract: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: April 16, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai
  • Publication number: 20110182593
    Abstract: An image-forming device includes a main casing, a drum unit, an image-forming unit, and a transfer unit. The drum unit is detachable from the main casing and includes a photosensitive drum having a rotational axis extending in an axis direction. The drum unit is formed with a plurality of symbols juxtaposed along the axis direction. The image-forming unit forms an image on the photosensitive drum in an image-forming mode. The transfer unit transfers the first developer image onto the photosensitive drum onto a sheet. The image-forming unit forms a first developer image on the photosensitive drum in a maintenance mode. The first developer image transferred onto the sheet divides the sheet into a plurality of regions along the axis direction, the plurality of regions corresponding to the plurality of symbols, respectively.
    Type: Application
    Filed: January 20, 2011
    Publication date: July 28, 2011
    Applicant: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Koji ABE, Takashi SHIMIZU, Haruyo ENDO, Yoshiki MORI, Jun HATTA, Shinji OGAWA, Mitsuyoshi MATSUDA
  • Publication number: 20100089758
    Abstract: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 15, 2010
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai
  • Publication number: 20100038115
    Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
    Type: Application
    Filed: March 31, 2006
    Publication date: February 18, 2010
    Applicant: MITSUI MINING & SMELTING CO., LTD
    Inventors: Mitsuyoshi Matsuda, Hisao Sakai, Sakito Tomonaga, Makoto Dobashi
  • Publication number: 20090166213
    Abstract: An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used.
    Type: Application
    Filed: October 31, 2006
    Publication date: July 2, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Ayumu Tateoka, Hiroshi Hata, Satoshi Mogi, Takeo Taguchi, Junshi Yoshioka
  • Publication number: 20090095515
    Abstract: An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter that has never been obtained in the art. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm2 to 100 kgf/mm2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received.
    Type: Application
    Filed: April 26, 2007
    Publication date: April 16, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Hisao Sakai, Masaru Takahashi, Mitsuyoshi Matsuda, Makoto Dobashi
  • Publication number: 20090047539
    Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.
    Type: Application
    Filed: March 9, 2007
    Publication date: February 19, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
  • Patent number: 6969557
    Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 ?m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: November 29, 2005
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Mitsuyoshi Matsuda, Takashi Kataoka
  • Publication number: 20040191560
    Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 &mgr;m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 30, 2004
    Inventors: Mitsuyoshi Matsuda, Takashi Kataoka
  • Patent number: 4821331
    Abstract: A coaxial speaker includes a low-frequency band speaker diaphragm which supports, at its inner periphery, a dust-proof member for the speaker core, via a step portion located on the diaphragm at this location. The step portion is planar and generally perpendicular to the speaker bobbin, and may be either a continuous ring or a series of discrete steps arrayed circularly.
    Type: Grant
    Filed: June 20, 1988
    Date of Patent: April 11, 1989
    Assignee: Pioneer Electronic Corporation
    Inventors: Fumio Murayama, Mitsuyoshi Matsuda