Abstract: A monolithic ceramic substrate includes a green laminate having a plurality of green functional ceramic layers including a functional ceramic material, green support layers including a ceramic material that does not sinter at a sintering temperature for the green functional ceramic material to prevent shrinkage of the functional ceramic layers, first conductor patterns including a thin-film conductor, and second conductor patterns including a thick-film conductor. The green laminate is fired at the sintering temperature for the green functional ceramic material.

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

Abstract: The present invention provides a multilayered ceramic substrate having high precision and high reliability in which firing shrinkage in the planar direction thereof is suppressed and densification is achieved. The multilayered ceramic substrate is manufactured by laminating base layers each composed of a non-glass type low-temperature sintering ceramic raw material powder as a main component, and shrinkage inhibiting layers each composed of a sintering-resistant powder of alumina or the like as a main component to form a green ceramic laminate, and then firing the green ceramic laminate at the sintering temperature of the low-temperature sintering ceramic raw material powder. The shrinkage inhibiting layers contain a powder which does not soften and flow at the firing shrinkage start temperature of the low-temperature sintering ceramic powder, but permeates into the spaces of the sintering-resistant powder due to softening and flowing to densify the shrinkage inhibiting layers before sintering is completed.

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Abstract: A ceramic substrate composition includes about 26 to 48% by weight of a CaO—Al2O3—B2O3—SiO2 type glass, about 35 to 68% by weight of at least one of alumina, mullite, cordierite and forsterite, and about 3 to 24% by weight of quartz, said glass being capable of being crystallized to wollastonite by firing of the composition at a temperature of about 800 to 1000° C. A ceramic circuit component contains a circuit formed on the ceramic substrate obtained by firing the composition.

Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

Abstract: A multilayered ceramic substrate which includes at least two types of ceramic layers respectively containing different ceramic materials, and which can be produced by simultaneous firing without causing layer peeling is described. A green composite laminated product is prepared in a state in which two substrate green sheets respectively contain different types of low-temperature sintered ceramic materials, and a shrinkage inhibiting green sheet containing an inorganic material which is not sintered at the sintering temperature of each of the low-temperature sintered ceramic material is arranged between the two substrate green sheets, followed by firing.

Abstract: Provided is an electrically conductive paste adapted to be sintered at the same time when a ceramic body is being sintered, wherein said paste has a contraction starting temperature that is higher than the contraction ending temperature of said ceramic body during the sintering treatment. Also provided is an electrically conductive paste comprising an electrically conductive component and an organic vehicle component, wherein said electrically conductive component comprises an electrically conductive powder mainly comprising silver, the particles of said electrically conductive powder being coated with a metal oxide having a melting point higher than that of silver.

Abstract: The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact having the plurality of the laminated ceramic green sheets containing the ceramic insulating material and the wiring conductor; providing raw sheet type bases on the principal plane at both ends with respect to the lamination direction of the raw compact, the raw sheet type bases containing a ceramic not to be sintered at the baking temperature of the raw compact; baking the raw compact in the state interposed between the sheet type bases so as to obtain the laminated member; and eliminating the unsintered sheet type bases; wherein the heat expansion coefficient difference of the sheet type bases and the laminated member after baking is 2.5×10−6 degK−1 or more.

Abstract: An electronic part having a plurality of substrates and a process for producing the same are disclosed, the electronic part comprising (1) a laminate comprising at least two previously fired substrates different in electrical characteristics each containing in the inside thereof a passive element, and an adhesive layer comprising glass which is interposed between said substrates, and (2) an outer electrode which is formed on the surface of the laminate of the substrates and is electrically connected to the passive elements, and the process comprising the steps of: separately firing at least two substrates different in electrical characteristics each containing in the inside thereof a passive element; adhering the substrates with an adhesive comprising glass; and forming an outer electrode on the surface of the laminate of the substrates in electrical connection to each passive element. Each substrate is free from warpage or cracking and containing no part remaining non-sintered.

Abstract: The present invention provides a multilayer ceramic substrate and a method of producing the same which can prevent occurrence of cracks when laminating different ceramic substrates or due to subsequent heat shock, and which has excellent moisture resistance and insulation properties and high reliability. The ceramic multilayer substrate has two ceramic substrates of different thermal expansion coefficients laminated by at least two glass layers of different thermal expansion coefficients which are between the thermal expansion coefficients of the ceramic substrates so that the thermal expansion coefficient changes stepwise between the ceramic substrates. The differences in thermal expansion coefficient between the ceramic substrate and the glass layer which are adjacent to each other, and between the adjacent glass layers are preferably not more than 1.times.10.sup.-6 /.degree.C.

Abstract: An electronic part having a plurality of substrates and a process for producing the same are disclosed, the electronic part comprising (1) a laminate comprising at least two previously fired substrates different in electrical characteristics each containing in the inside thereof a passive element, and an adhesive layer comprising glass which is interposed between said substrates, and (2) an outer electrode which is formed on the surface of the laminate of the substrates and is electrically connected to the passive elements, and the process comprising the steps of: separately firing at least two substrates different in electrical characteristics each containing in the inside thereof a passive element; adhering the substrates with an adhesive comprising glass; and forming an outer electrode on the surface of the laminate of the substrates in electrical connection to each passive element. Each substrate is free from warpage or cracking and containing no part remaining non-sintered.

Abstract: The present invention provides a multilayer ceramic substrate and a method of producing the same which can prevent occurrence of cracks when laminating different ceramic substrates or due to subsequent heat shock, and which has excellent moisture resistance and insulation properties and high reliability. The ceramic multilayer substrate has two ceramic substrates of different thermal expansion coefficients laminated by at least two glass layers of different thermal expansion coefficients which are between the thermal expansion coefficients of the ceramic substrates so that the thermal expansion coefficient changes stepwise between the ceramic substrates. The differences in thermal expansion coefficient between the ceramic substrate and the glass layer which are adjacent to each other, and between the adjacent glass layers are preferably not more than 1.times.10.sup.-6 /.degree. C.

Abstract: In order to form internal conductors of a multilayer ceramic electronic component such as a multilayer ceramic capacitor, copper paste containing copper powder having a mean particle size of 0.3 to 2 .mu.m in a particle size range of 0.1 to 4 .mu.m and ceramic powder having a main component which is common to that of a ceramic material contained in the multilayer ceramic electronic component and being in a particle size range of 0.5 to 8 .mu.m, as well as an organic vehicle and a solvent with the contents of the copper powder and the ceramic powder and the total content of the organic vehicle and the solvent in ranges of 40 to 70 percent by weight, 1 to 15 percent by weight and 25 to 60 percent by weight respectively is applied onto ceramic green sheets. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the as-obtained multilayer ceramic electronic component.

Abstract: In order to form internal conductors of a multilayer ceramic electronic component such as a multilayer ceramic capacitor, copper paste containing copper powder having a mean particle size of 0.3 to 2 .mu.m in a particle size range of 0.1 to 4 .mu.m and ceramic powder having a main component which is common to that of a ceramic material contained in the multilayer ceramic electronic component and being in a particle size range of 0.5 to 8 .mu.m, as well as an organic vehicle and a solvent with the contents of the copper powder and the ceramic powder and the total content of the organic vehicle and the solvent in ranges of 40 to 70 percent by weight, 1 to 15 percent by weight and 25 to 60 percent by weight respectively is applied onto ceramic green sheets. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the as-obtained multilayer ceramic electronic component.