Patents by Inventor Mitsuyoshi Nishino
Mitsuyoshi Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230094806Abstract: A metal-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by Formula (1) in a molecule and a metal foil that is laminated on the insulating layer and is a metal foil in which a nickel element amount on a surface on a side in contact with the insulating layer and a nickel element amount on the surface when the surface is sputtered for 1 minute at 3 nm/min in terms of SiO2 are each 4.5 at % or less with respect to the total element amount on each surface. In Formula (1), Z represents an arylene group, R1-R3 each independently represent a hydrogen atom or an alkyl group, and R4-R6 each independently represent a hydrogen atom or an alkyl group having 1-6 carbon atoms.Type: ApplicationFiled: October 15, 2020Publication date: March 30, 2023Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira IRIFUNE, Shun YAMAGUCHI, Fuminori SATOU, Tatsuya ARISAWA, Mitsuyoshi NISHINO
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Publication number: 20210395452Abstract: A metal-clad laminate includes an insulating layer, and a metal foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a polyphenylene ether compound, and the metal foil is a metal foil in which a first nickel element amount, on a surface on a side in contact with the insulating layer, measured by X-ray photoelectron spectroscopy is 4.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a second nickel element amount, on a surface on a side in contact with the insulating layer when the surface is sputtered for 1 minute at a speed of 3 nm/min in terms of SiO2, measured by X-ray photoelectron spectroscopy is 4.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy.Type: ApplicationFiled: September 27, 2019Publication date: December 23, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tatsuya ARISAWA, Shun YAMAGUCHI, Fuminori SATOU, Akira IRIFUNE, Mitsuyoshi NISHINO
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Patent number: 10017601Abstract: A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.Type: GrantFiled: June 24, 2014Date of Patent: July 10, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Daisuke Nii, Mitsuyoshi Nishino, Fuminori Sato, Yoshihiko Nakamura
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Patent number: 9775239Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.Type: GrantFiled: April 7, 2015Date of Patent: September 26, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tatsuya Arisawa, Yoshihiko Nakamura, Tomoyuki Abe, Kiyotaka Komori, Syouji Hasimoto, Mitsuyoshi Nishino
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Patent number: 9730320Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.Type: GrantFiled: October 27, 2011Date of Patent: August 8, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Naoyuki Tani, Yoshito Kitagawa
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Patent number: 9718941Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 ?m; (B) aluminum oxide particles having an average particle size (D50) of 1.5 ?m or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.Type: GrantFiled: April 27, 2012Date of Patent: August 1, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Takashi Matsuda, Mitsuyoshi Nishino, Kiyotaka Komori
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Publication number: 20170099731Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.Type: ApplicationFiled: April 7, 2015Publication date: April 6, 2017Inventors: TATSUYA ARISAWA, YOSHIHIKO NAKAMURA, TOMOYUKI ABE, KIYOTAKA KOMORI, SYOUJI HASIMOTO, MITSUYOSHI NISHINO
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Publication number: 20160369042Abstract: A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.Type: ApplicationFiled: June 24, 2014Publication date: December 22, 2016Inventors: Daisuke NII, Mitsuyoshi NISHINO, Fuminori SATO, Yoshihiko NAKAMURA
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Publication number: 20140087614Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 ?m; (B) aluminum oxide particles having an average particle size (D50) of 1.5 ?m or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.Type: ApplicationFiled: April 27, 2012Publication date: March 27, 2014Applicant: PANASONIC CORPORATIONInventors: Takashi Matsuda, Mitsuyoshi Nishino, Kiyotaka Komori
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Patent number: 8603624Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.Type: GrantFiled: October 29, 2010Date of Patent: December 10, 2013Assignee: Panasonic CorporationInventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Yoshito Kitagawa, Naoyuki Tani
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Publication number: 20130215628Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.Type: ApplicationFiled: October 27, 2011Publication date: August 22, 2013Applicant: PANASONIC CORPORATIONInventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Naoyuki Tani, Yoshito Kitagawa
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Publication number: 20120228010Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.Type: ApplicationFiled: October 29, 2010Publication date: September 13, 2012Inventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Yoshito Kitagawa, Naoyuki Tani
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Publication number: 20110250459Abstract: The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.Type: ApplicationFiled: December 17, 2009Publication date: October 13, 2011Inventors: Mitsuyoshi Nishino, Fuminori Satou, Kentaro Fujino, Yoshihiko Nakamura
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Publication number: 20100096173Abstract: The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks. This epoxy resin composition includes: (A) an epoxy resin; (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent, (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A).Type: ApplicationFiled: February 21, 2008Publication date: April 22, 2010Inventors: Kentaro Fujino, Tomoaki Sawada, Mitsuyoshi Nishino, Takashi Shinpo, Yoshihiko Nakamura, Mao Yamaguchi