Patents by Inventor Mitsuyoshi Shimamura

Mitsuyoshi Shimamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive film, roll, connected structure, and process for producing connected structure
    Patent number: 11667817
    Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: June 6, 2023
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Takashi Tatsuzawa, Kazuya Matsuda, Yutaka Tsuchida, Takashi Seki, Mitsuyoshi Shimamura, Kengo Shinohara, Tetsuyuki Shirakawa, Yasunori Kawabata, Satoru Matsumoto
  • ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
    Publication number: 20230137299
    Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO
  • ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
    Publication number: 20190241771
    Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
    Type: Application
    Filed: September 26, 2017
    Publication date: August 8, 2019
    Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO
  • Adhesive film
    Patent number: 9327418
    Abstract: An adhesive film includes a film-like adhesive layer and a pair of separators sandwiching the adhesive layer. The outer edges of both separators extend outward beyond the outer edge of the adhesive layer, and a blade is used to form a notch on the adhesive layer side of the heavy release separator, along the outer edge of the adhesive layer. The thickness of the heavy release separator is between 50 ?m and 200 ?m, the average notch depth is between 5 ?m and 45 ?m and the standard deviation for the notch depth is no greater than 15 ?m. Specifying the notch depth allows complete cutting of the adhesive layer with the blade, while also limiting release problems between the heavy release separator and the adhesive layer.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: May 3, 2016
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kouhei Horiuchi, Michio Uruno, Hiroaki Takahashi, Tomoyuki Nakamura, Mitsuyoshi Shimamura
  • ADHESIVE FILM AND METHOD FOR PRODUCING THE SAME
    Publication number: 20130071596
    Abstract: An adhesive film includes a film-like adhesive layer and a pair of separators sandwiching the adhesive layer. The outer edges of both separators extend outward beyond the outer edge of the adhesive layer, and a blade is used to form a notch on the adhesive layer side of the heavy release separator, along the outer edge of the adhesive layer. The thickness of the heavy release separator is between 50 ?m and 200 ?m, the average notch depth is between 5 ?m and 45 ?m and the standard deviation for the notch depth is no greater than 15 ?m. Specifying the notch depth allows complete cutting of the adhesive layer with the blade, while also limiting release problems between the heavy release separator and the adhesive layer.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 21, 2013
    Inventors: Kouhei HORIUCHI, Michio Uruno, Hiroaki Takahashi, Tomoyuki Nakamura, Mitsuyoshi Shimamura