Abstract: An apparatus for recycling a grinding slurry capable of effectively removing unwanted components at a reduced cost. Slurry used in a grinding treatment is at first recovered as recovery slurry. The recovery slurry is then recycled so as to obtain recycled slurry. One or more cyclone separators are provided and used for sizing the used slurry to obtain slurry particles having a predetermined particle size. The slurry having the predetermined particle size is supplied as recovery slurry. When the recovery slurry is recycled to produce recycled slurry, one or more supersonic wave generators are used for irradiating supersonic waves to the recovery slurry.

Abstract: An apparatus for recycling a grinding slurry capable of effectively removing unwanted components at a reduced cost. Slurry used in a grinding treatment is at first recovered as recovery slurry. The recovery slurry is then recycled so as to obtain recycled slurry. One or more cyclone separators are provided and used for sizing the used slurry to obtain slurry particles having a predetermined particle size. The slurry having the predetermined particle size is supplied as recovery slurry. When the recovery slurry is recycled to produce recycled slurry, one or more supersonic wave generators are used for irradiating supersonic waves to the recovery slurry.

Abstract: A polishing apparatus includes a polishing pad, a substrate holder, and a retainer ring. The polishing pad is adhered to a polishing table. The substrate holder urges, while it holds a substrate as a polishing target, a polishing target surface of the substrate against the polishing pad. The retainer ring is formed on a holding surface of the substrate holder to correspond to the circumference of the substrate. The retainer ring has a resin portion formed on its surface which is to come into contact with the polishing pad, and an annular resin holding portion for holding the resin portion and made of a material having a higher mechanical strength than the resin portion.

Abstract: A stage is provided with pressing holes arranged circumferentially and suctioning holes arranged circumferentially to be close to the outer peripheral edge side compared to the pressing holes. A cavity connected to these pressing holes and suctioning holes is provided within a wafer holder. In addition, first filters, which allow a gas to flow from the cavity side to the wafer holding surface side, are arranged between the pressing holes and the cavity. Second filters, which allow a gas to flow only from the wafer holding surface side to the cavity side, are arranged between the suctioning holes and the cavity.