Abstract: The present invention provides a method for manufacturing a metal film material, the method including: applying an ink composition by discharging the ink composition onto a substrate via an inkjet method, the ink composition containing at least one first monomer having at least one group selected from the group consisting of a cyano group, an alkyloxy group, an amino group, a pyridine residue, a pyrrolidone residue, an imidazole residue, an alkylsulfanyl group, or a cyclic ether residue, at least one second monomer that has polyfunctionality, and at least one polymerization initiator, a total monomer content in the ink composition being 85% by mass or greater; forming a cured film by carrying out at least one of light exposure or heating of the ink composition that has been applied; applying a plating catalyst or a precursor thereof to the cured film; and a plating processing step of performing plating with respect to the plating catalyst or precursor thereof that has been applied.

Abstract: Disclosed is a multilayer film for plating comprising, on a surface of a first substrate, a plating receptive layer which contains a polymer having a polymerizable group and a functional group, wherein the plating receptive layer satisfies at least one of the following (1)-(4): (1) the saturated water absorption ratio is from 0.01 to 10% by mass in an environment of a temperature of 25° C. and relative humidity of 50%; (2) the saturated water absorption ratio is from 0.05 to 20% by mass in an environment of a temperature of 25° C. and relative humidity of 95%; (3) the water absorption ratio is from 0.1 to 30% by mass after immersion in boiling water at 100° C. for one hour; and (4) the surface contact angle of distilled water is from 50° to 150° after 5 ?l of the distilled water is dropped onto the plating receptive layer and allowed to stand for 15 seconds in an environment of a temperature of 25° C. and relative humidity of 50%.

Abstract: A resin complex which is capable of being plated, is highly hydrophobic, and has excellent molding properties and good adhesion to a plated layer, a laminate including a layer of the resin complex, and a method of manufacturing the laminate are provided. The resin complex capable of being plated includes a hydrophobic compound A having a functional group capable of interacting with a plating catalyst, its precursor or a metal, and a hydrophobic resin B incompatible with the hydrophobic compound A. The resin complex has a phase-separated morphology in which the hydrophobic compound A forms a dispersed phase and the hydrophobic resin B forms a continuous phase and the hydrophobic compound A is exposed on at least part of a surface of the resin complex.

Abstract: The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal.

Abstract: The present invention provides a method for producing a multilayer wiring substrate, including: forming a laminated body having an insulating resin layer and a polymer adhesive layer, on a surface of a first wiring substrate wherein the polymer adhesive layer contains a polymer precursor interacting with a plating catalyst or a precursor thereof, and a reactive group bonding with an adjacent layer on the first wiring substrate side; applying energy to a region outside of a via connection portion on the surface of the laminated body, to form a patterned polymer adhesive layer; applying a plating catalyst or a precursor thereof to the patterned polymer adhesive layer, and carrying out a first electroless plating, to form a second metal wiring on the surface of the patterned polymer adhesive layer; and forming a via by utilizing the patterned second metal wiring as a mask, and subsequently carrying out a desmear treatment.

Abstract: A method of fabricating a circuit board includes: forming an adhesion auxiliary layer on a surface of an insulating base board; forming an adhesion layer on a surface of the adhesion auxiliary layer, the adhesion layer comprising a polymer compound having a polymerizable group and a functional group capable of interacting with a plating catalyst or a precursor thereof; fixing the adhesion layer to the adhesion auxiliary layer by applying energy to the adhesion layer; applying a plating catalyst or a precursor thereof to the adhesion layer; forming a first metal film by electroless plating on the adhesion layer; and performing electroplating by using the first metal film; and the method further includes partly removing, by irradiating a laser beam, an area corresponding to a non-circuit portion in any of the adhesion auxiliary layer, the adhesion layer, or the first metal film.

Abstract: The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal.

Abstract: Disclosed is a multilayer film for plating comprising, on a surface of a first substrate, a plating receptive layer which contains a polymer having a polymerizable group and a functional group, wherein the plating receptive layer satisfies at least one of the following (1)-(4): (1) the saturated water absorption ratio is from 0.01 to 10% by mass in an environment of a temperature of 25° C. and relative humidity of 50%; (2) the saturated water absorption ratio is from 0.05 to 20% by mass in an environment of a temperature of 25° C. and relative humidity of 95%; (3) the water absorption ratio is from 0. 1 to 30% by mass after immersion in boiling water at 100° C. for one hour; and (4) the surface contact angle of distilled water is from 50° to 150° after 5 ?l of the distilled water is dropped onto the plating receptive layer and allowed to stand for 15 seconds in an environment of a temperature of 25° C. and relative humidity of 50%.

Abstract: Disclosed is a laminate comprising, on a support: an insulating resin composition layer configured to produce a reactive active species when provided with energy; and a reactive polymer precursor layer containing a compound configured to react with the insulating resin composition layer and form a polymer compound.

Abstract: A microcapsule produced by a method involving a primary dispersed particle and a secondary dispersed particle, the capsule formation occurring at the interface of the secondary dispersed particle. A microcapsule containing a diazonium salt represented by a specific formula. A recording material utilizing the microcapsule.

Abstract: The invention provides a multilayer wiring board including wiring patterns formed with a multilayer structure with at least one electrical insulating layer interposed therebetween, the wiring patterns being electrically connected with each other through at least one via formed in the insulating layer(s). The multilayer wiring board includes at least one wiring containing layer on one side or both sides of a substrate, or of a circuit board having a predetermined wiring pattern.

Abstract: The present invention provides a laminated body for producing a printed wiring board, which includes an adhesive layer that is provided between an insulating film for a printed wiring board and a metal film for forming wiring. The adhesive layer includes an active species generating composition that is capable of generating an active species having reactivity by energy application, and a polymer precursor composition that includes a compound capable of forming a polymer compound by reaction with the active species generating composition. The invention also provides a method of producing a printed wiring board.

Abstract: A compound represented by formula (I); a multifunctional isocyanate composition, containing an adduct formed by treating the compound represented by formula (I) with a compound represented by formula (II); and a microcapsule using the multifunctional isocyanate composition: wherein, in formula (I), R1 represents -L1-X1 or X1; R2 represents a hydrogen atom or -L2-X2; L1 and L2 each independently represent a divalent linking group; X1 and X2 each independently represent a nucleophilic substituent; n represents an integer of 1 to 4; and when n is 2 or more, R1s may be the same or different; and R3—(NCO)m??Formula (II) wherein, in formula (II), R3 represents an arbitrary m-valent linking group; and m represents an integer of 2 or above.

Abstract: A compound represented by formula (I); a multifunctional isocyanate composition, containing an adduct formed by treating the compound represented by formula (I) with a compound represented by formula (II); and a microcapsule using the multifunctional isocyanate composition: wherein, in formula (I), R1 represents -L1-X1 or X1; R2 represents a hydrogen atom or -L2-X2; L1 and L2 each independently represent a divalent linking group; X1 and X2 each independently represent a nucleophilic substituent; n represents an integer of 1 to 4; and when n is 2 or more, R1s may be the same or different; and R3—(NCO)m??Formula (II) wherein, in formula (II), R3 represents an arbitrary m-valent linking group; and m represents an integer of 2 or above.

Abstract: A microcapsule produced by a method involving a primary dispersed particle and a secondary dispersed particle, the capsule formation occurring at the interface of the secondary dispersed particle. A microcapsule containing a diazonium salt represented by a specific formula. A recording material utilizing the microcapsule.

Abstract: The present invention provides a method for forming an azo colorant by reaction of a diazo compound and a coupler. The coupler has a leaving group at the coupling position thereof, such that a coupling reaction rate is faster than it would be if the coupler did not have the leaving group. The coupling reaction rate constant k is preferably 0.1 (s?1) or more.

Abstract: The invention provides a heat-sensitive recording material and a method for preparing the material. The material has a substrate and a plurality of layers formed on the substrate is provided. Among the plurality of layers, at least two layers are heat-sensitive recording layers, and at least one layer among the plurality of layers contains gelatin or a gelatin derivative as a binder, and is hardened with an active olefin. It is preferable that the plural layers include at least one of an intermediate layer and a protective layer, and that at least one of these is the layer hardened with the active olefin. It is preferable that the active olefin is contained in an amount of 1 to 40% by mass relative to the gelatin or gelatin derivative.

Abstract: An object of the present invention is to provide a heat sensitive recording material which can develop color at high density by the inclusion of a novel guanidine compound which is strongly basic and superior in diffusion resistance. The present invention for attaining the above-described object is a heat sensitive recording material comprising a substrate supporting thereon a heat sensitive recording layer containing a diazonium salt compound, a coupler which reacts with the diazonium salt compound when heated to develop color, and a base, wherein the heat sensitive recording layer includes as the base at least one of the guanidine compounds represented by the general formula (1): wherein, in the general formula (1), R1 and R2 represent an alkyl group or aryl group and may be the same or different, R3 and R4 represent a hydrogen atom, alkyl group or halogen atom and may be the same or different, and X represents a divalent connecting group.

Abstract: Disclosed is a multicolor heat-sensitive recording material at least having a yellow-forming heat-sensitive recording material, a cyan-forming heat-sensitive recording material, and a magenta-forming heat-sensitive recording material disposed on a support, characterized in that, if laminates are made of a transparent support, a single layer of these heat-sensitive recording layers, and a protective layer in the order listed, the haze values of the laminates are all not greater than 40.

Abstract: An object of the present invention is to provide a heat sensitive recording material which can develop color at high density by the inclusion of a novel guanidine compound which is strongly basic and superior in diffusion resistance.