Patents by Inventor Mitsuzo YOKOYAMA

Mitsuzo YOKOYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board and method of manufacturing the same
    Patent number: 9326389
    Abstract: Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: April 26, 2016
    Assignee: KYOCERA CIRCUIT SOLUTIONS, INC.
    Inventor: Mitsuzo Yokoyama
  • WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150116967
    Abstract: Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region.
    Type: Application
    Filed: October 20, 2014
    Publication date: April 30, 2015
    Applicant: KYOCERA CIRCUIT SOLUTIONS, INC.
    Inventor: Mitsuzo YOKOYAMA