Patents by Inventor Mituharu Hayashi

Mituharu Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit
    Patent number: 5523625
    Abstract: A semiconductor integrated circuit device has upper wirings extending on an inter-level insulating layer covering a lower wiring at spacing with zig-zag side surfaces between the upper wirings, and the zig-zag lines are transferred to the inter-level insulating layer so as to prevent the upper wirings from short circuit due to a residue of conductive material for the upper wirings.
    Type: Grant
    Filed: October 19, 1994
    Date of Patent: June 4, 1996
    Assignee: NEC Corporation
    Inventor: Mituharu Hayashi