Patents by Inventor Mitul Bharat MODI

Mitul Bharat MODI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
    Publication number: 20220352121
    Abstract: Semiconductor packages including passive support wafers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes a passive support wafer mounted on several active dies. The active dies may be attached to an active die wafer, and the passive support wafer may include a monolithic form to stabilize the active dies and active die wafer during processing and use. Furthermore, the passive support wafer may include a monolith of non-polymeric material to transfer and uniformly distribute heat generated by the active dies.
    Type: Application
    Filed: July 5, 2022
    Publication date: November 3, 2022
    Inventors: Debendra MALLIK, Digvijay A. RAORANE, Ravindranath Vithal MAHAJAN, Mitul Bharat MODI
  • Semiconductor package having passive support wafer
    Patent number: 11417630
    Abstract: Semiconductor packages including passive support wafers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes a passive support wafer mounted on several active dies. The active dies may be attached to an active die wafer, and the passive support wafer may include a monolithic form to stabilize the active dies and active die wafer during processing and use. Furthermore, the passive support wafer may include a monolith of non-polymeric material to transfer and uniformly distribute heat generated by the active dies.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 16, 2022
    Assignee: Intel Corporation
    Inventors: Debendra Mallik, Digvijay A. Raorane, Ravindranath Vithal Mahajan, Mitul Bharat Modi
  • SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
    Publication number: 20190287942
    Abstract: Semiconductor packages including passive support wafers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes a passive support wafer mounted on several active dies. The active dies may be attached to an active die wafer, and the passive support wafer may include a monolithic form to stabilize the active dies and active die wafer during processing and use. Furthermore, the passive support wafer may include a monolith of non-polymeric material to transfer and uniformly distribute heat generated by the active dies.
    Type: Application
    Filed: December 29, 2016
    Publication date: September 19, 2019
    Inventors: Debendra MALLIK, Digvijay A. RAORANE, Ravindranath Vithal MAHAJAN, Mitul Bharat MODI