Patents by Inventor Mituo Katou

Mituo Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5431324
    Abstract: An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.
    Type: Grant
    Filed: January 22, 1993
    Date of Patent: July 11, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Mituo Katou, Kazuya Takahashi, Minoru Maruta, Tokiyuki Seto, Kunihiro Tsubosaki
  • Patent number: 4912669
    Abstract: A document editing system for storing a plurality of format data records in a tree structure which define the format of a document. The format data records comprise any combination of a title field, a basic field, and a group field. A document data management section, in response to a document preparation request from a work station, prepares a basic document having a tree structure consistent with the document format data records. Furthermore, the document data management section updates the basic document with externally input data to prepare a target document. The document data management section determines the number of lines and characters per line of a group field including a line/character increase or decrease field, from a tree structure subordinate to the group field.
    Type: Grant
    Filed: September 17, 1986
    Date of Patent: March 27, 1990
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tadahiro Iwamoto, Mituo Katou, Masakazu Yamamoto
  • Patent number: 4809058
    Abstract: An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: February 28, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Ryoichi Kajiwara, Mituo Katou, Takeshi Matsuzaka, Tomohiko Shida, Hiroshi Wachi, Kazuya Takahashi, Masatoshi Watanabe, Minoru Yamada, Keiichirou Nakanishi, Katuo Sugawara