Abstract: The chuck for conveying semiconductor wafers has a pair of swing arms. Each arm has lower horizontal rods provided with a plurality of grooves for holding wafers and with vertical rods sandwiching the horizontal rods between them. A chuck cleaning apparatus has a cleaning chamber in a casing. A partition plate extends along the center of the cleaning chamber to divide it into first and second compartments. The top of the cleaning chamber is closed by a shielding plate, which has a pair of openings through which the arms come into and out of the cleaning chamber. A washing liquid pipe is incorporated with the partition plate in a horizontal direction. A pair of drying gas pipes extend horizontally in each of the first and second compartments and they are positioned a little higher than the liquid pipe, sandwiching each arm between them.