Patents by Inventor Mituo Yamada

Mituo Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for sealing semiconductor packages
    Patent number: 4764235
    Abstract: An apparatus and method are described for sealing semiconductor packages made from a thermoplastic resin wherein a lead frame is positioned vertically at a center axis of the apparatus and a pair of mold parts having cavities for housing flat moldings are positioned symmetrically as to said center axis. With the described method and apparatus, sealed semiconductor packages with excellent sealing properties can be produced.
    Type: Grant
    Filed: July 30, 1986
    Date of Patent: August 16, 1988
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Keiji Hazama, Shin'ichi Ota, Mituo Yamada, Toshiyuki Arai