Patents by Inventor Miu TAKIMOTO

Miu TAKIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210319991
    Abstract: A sample support is a sample support for sample ionization, including: a substrate formed with a plurality of through holes opening to a first surface and a second surface on a side opposite to the first surface; a conductive layer provided not to block the through hole in the first surface; and a frame body provided in a peripheral portion of the substrate to surround an ionization region in which a sample is ionized when viewed in a thickness direction of the substrate, in which a marker for recognizing a position in the ionization region is provided in the frame body.
    Type: Application
    Filed: July 25, 2019
    Publication date: October 14, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Miu TAKIMOTO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20210257201
    Abstract: A sample support is a sample support for sample ionization, including: a substrate formed with a plurality of through holes opening to a first surface and a second surface on a side opposite to the first surface; a conductive layer provided not to block the through hole in the first surface; and a reinforcement member disposed inside a part of the plurality of through holes.
    Type: Application
    Filed: June 19, 2019
    Publication date: August 19, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Miu TAKIMOTO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20210028002
    Abstract: A sample support body for ionizing a sample, including: a first layer formed with a plurality of first through holes; a conductive layer provided on a surface of the first layer; and a second layer provided on the first layer on a side opposite to the conductive layer and formed with a plurality of second through holes, in which the plurality of first through holes and the plurality of second through holes extend in a thickness direction of the first layer and the second layer, each of the plurality of second through holes is communicated with one or more first through holes of the plurality of first through holes, a width of the first through hole is smaller than a width of the second through hole, and an opening rate of the first through hole is less than an opening rate of the second through hole.
    Type: Application
    Filed: December 12, 2018
    Publication date: January 28, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Miu TAKIMOTO, Takayuki OHMURA, Masahiro KOTANI