Patents by Inventor Miu W. Sing

Miu W. Sing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4789437
    Abstract: A process is provided for obtaining crack-free deposits of rhodium by a pulse electroplating process.
    Type: Grant
    Filed: July 11, 1986
    Date of Patent: December 6, 1988
    Assignee: University of Hong Kong
    Inventors: Miu W. Sing, Fung Y. Sing