Patents by Inventor Miya Tanioka

Miya Tanioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11680076
    Abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: June 20, 2023
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Noriaki Yamaji, Takahito Imamine, Masahiko Tsujino, Hirohiko Hirao
  • Patent number: 11472823
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: October 18, 2022
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
  • Publication number: 20210179642
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Application
    Filed: February 24, 2021
    Publication date: June 17, 2021
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki YAMAJI, Takayuki MURAl, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Takahito IMAMINE, Masahiko TSUJINO, Tomoya MAE, Hirohiko HIRAO
  • Patent number: 11014946
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: May 25, 2021
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
  • Patent number: 10975108
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 13, 2021
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
  • Publication number: 20200223875
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Application
    Filed: July 31, 2018
    Publication date: July 16, 2020
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki YAMAJI, Takayuki MURAl, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Takahito IMAMINE, Masahiko TSUJINO, Tomoya MAE, Hirohiko HIRAO
  • Publication number: 20200031852
    Abstract: The abstract of the international application is being replace by the following abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.
    Type: Application
    Filed: April 5, 2018
    Publication date: January 30, 2020
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takayuki MURAI, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Noriaki YAMAJI, Takahito IMAMINE, Masahiko TSUJINO, Hirohiko HIRAO
  • Patent number: 9688704
    Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: June 27, 2017
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shozo Miura, Takayuki Murai, Naoto Okumura, Miya Tanioka, Masato Katsumura, Noriaki Yamaji
  • Publication number: 20160368935
    Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
    Type: Application
    Filed: June 30, 2014
    Publication date: December 22, 2016
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shozo MIURA, Takayuki MURAI, Naoto OKUMURA, Miya TANIOKA, Masato KATSUMURA, Noriaki YAMAJI
  • Patent number: 5560785
    Abstract: A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: October 1, 1996
    Assignee: Shikoku Chemicals Corporation
    Inventors: Hirohiko Hirao, Yoshimasa Kikukawa, Toshihiro Okamoto, Takayuki Murai, Seiji Sogabe, Miya Tanioka, Rie Nakayama, Takashi Yoshioka
  • Patent number: 5498301
    Abstract: An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserves excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredient, a 2-arylimidazole compound represented by the following formula, ##STR1## wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, ##STR2## wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case where R, R1 and R2 are all hydrogen atoms.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: March 12, 1996
    Assignee: Shikoku Chemicals Corporation
    Inventors: Hirohiko Hirao, Yoshimasa Kikukawa, Toshihiro Okamoto, Takayuki Murai, Seiji Sogabe, Miya Tanioka, Rie Nakayama, Takashi Yoshioka