Patents by Inventor Miyakawa Takuya

Miyakawa Takuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6100496
    Abstract: A method and apparatus for bonding components with a brazing material is described in which atmospheric plasma with active species is created by gas discharge generated in a gas capable of discharge at or about atmospheric pressure, and a portion of a component is exposed to the atmospheric plasma, thereby surface treating it. Prior to, simultaneously with, or following the surface treatment, bonding is accomplished with a brazing material. Surface treating the portion of the component allows using solder and, for example, a low-corrosive or no-rinse flux, or no flux, in an efficient bonding process. Furthermore, unwanted organic substances, for example, left over flux, may be removed by exposing the component to surface treatment, for example, after bonding is completed, or, if the component has residual undesirable organic substances, for example, left over from its manufacture, surface treatment may be performed prior to bonding.
    Type: Grant
    Filed: September 11, 1998
    Date of Patent: August 8, 2000
    Assignee: Seiko Epson Corporation
    Inventors: Miyakawa Takuya, Mori Yoshiaki, Kurashima Yohei, Anan Makoto
  • Patent number: 5831238
    Abstract: A method and apparatus for bonding components with a brazing material is described in which atmospheric plasma with active species is created by gas discharge generated in a gas capable of discharge at or about atmospheric pressure, and a portion of a component is exposed to the atmospheric plasma, thereby surface treating it. Prior to, simultaneously with, or following the surface treatment, bonding is accomplished with a brazing material. Surface treating the portion of the component allows using solder and, for example, a low-corrosive or no-rinse flux, or no flux, in an efficient bonding process. Furthermore, unwanted organic substances, for example, left over flux, may be removed by exposing the component to surface treatment, for example, after bonding is completed, or, if the component has residual undesirable organic substances, for example, left over from its manufacture, surface treatment may be performed prior to bonding.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: November 3, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Miyakawa Takuya, Mori Yoshiaki, Kurashima Yohei, Anan Makoto