Patents by Inventor Miyako Ichikawa

Miyako Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive resin composition and method for formation of resist pattern by use thereof
    Patent number: 6576409
    Abstract: A photosensitive resin composition and a method of forming a positive resist pattern by the use of the composition are disclosed. The photosensitive resin composition comprises (A) a resinous compound containing an acid-decomposing ester group, (B) a compound containing one ethylenically unsaturated bond in its molecule and possessing a group capable of forming a carboxylic acid via decomposition by the action of an acid, (C) a photo-acid generator, (D) a photo-radical polymerization initiator, and optionally (E) an epoxy resin.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: June 10, 2003
    Assignee: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Miyako Ichikawa, Masaki Sasaki, Teruo Saito
  • Photosensitive resin composition and method for formation of resist pattern by use thereof
    Publication number: 20020102501
    Abstract: A photosensitive resin composition and a method of forming a positive resist pattern by the use of the composition are disclosed. The photosensitive resin composition comprises (A) a resinous compound containing an acid-decomposing ester group, (B) a compound containing one ethylenically unsaturated bond in its molecule and possessing a group capable of forming a carboxylic acid via decomposition by the action of an acid, (C) a photo-acid generator, (D) a photo-radical polymerization initiator, and optionally (E) an epoxy resin.
    Type: Application
    Filed: January 14, 2002
    Publication date: August 1, 2002
    Inventors: Miyako Ichikawa, Masaki Sasaki, Teruo Saito
  • Photosensitive resin composition and method for formation of resist pattern by use thereof
    Patent number: 6338936
    Abstract: A photosensitive resin composition and a method of forming a positive resist pattern by the use of the composition are disclosed. The photosensitive resin composition comprises (A) a resinous compound containing an acid-decomposing ester group, (B) a compound containing one ethylenically unsaturated bond in its molecule and possessing a group capable of forming a carboxylic acid via decomposition by the action of an acid, (C) a photo-acid generator, (D) a photo-radical polymerization initiator, and optionally (E) an epoxy resin.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: January 15, 2002
    Assignee: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Miyako Ichikawa, Masaki Sasaki, Teruo Saito