Abstract: An imaging apparatus comprises a first imaging unit, a second imaging unit whose use frequency is lower than that of the first imaging unit, an exterior case for housing the first imaging unit and the second imaging unit, and a brace mounting section mounted to the exterior case so as to be partially exposed to an outside. The first imaging unit, the second imaging unit and the brace mounting section are arranged so that a distance from the first imaging unit to the brace mounting section is longer than a distance from the second imaging unit to the brace mounting section.

Abstract: An imaging apparatus includes a plurality of imaging units, and a radiator operable to uniformize temperatures of the plurality of the imaging units.

Abstract: An image pickup device includes a color separation prism composed of prism members and which separates light into color components, solid-state image sensors fixed to the prism members, respectively, image sensor boards on which the solid-state image sensors are mounted, respectively, an image control board to which image pickup signals generated by the image sensor boards, respectively, are inputted, and a flexible board which is connected to the image control board. The flexible board includes a signal transmission layer connected to each of the image sensor boards and which contains transmission paths for transmitting the image pickup signals to the image control board, and a heat radiating layer formed of a high heat conductivity material which is connected to each of the solid-state image sensors and fixed to the signal transmission layer via an insulating layer to transfer heat generated in the solid-state image sensors.

Abstract: A heatsink structure for solid-state image sensors includes a foil-like heatsink sheet made of a high heat conductivity material. The heatsink sheet has a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member. The heatsink sheet also has a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the heatsink structure can cool the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure.

Abstract: A display apparatus including a display device, circuit boards on which circuits for driving the display device are formed, a chassis plate having a first surface to which the display device is mounted and a second surface to which the circuit boards are mounted, and a back cover fastened onto the second surface of the chassis plate by screws. The chassis plate has a first radiating rib, and the back cover has a second radiating rib that is in surface contact with the first radiating rib.

Abstract: In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.

Abstract: The image pickup device includes a color separation prism which is composed of a plurality of prism members and which separates light into a plurality of color components, a plurality of solid-state image sensors fixed to the plurality of prism members, respectively, a plurality of image sensor boards on which the plurality of solid-state image sensors are mounted, respectively, an image control board to which image pickup signals generated by the plurality of image sensor boards, respectively, are inputted, and a flexible board which is connected to the image control board.

Abstract: The image pickup device includes a color separation prism, solid-state image sensors, a light shielding layer and a heat radiating layer. The color separation prism, made up of a plurality of prism members, separates light incident thereon through an image pickup lens into a plurality of color components. The plurality of solid-state image sensors are fixed to the plurality of prism members, respectively. The light shielding layer is placed so as to cover surfaces of the color separation prism. The heat radiating layer, formed from a high heat conductivity material, is placed on a surface of the light shielding layer so as to be kept from contact with each of the solid-state image sensors. Thus, in the image pickup device, temperature increases of the solid-state image sensors are suppressed while external-force loads applied to the solid-state image sensors are reduced, with a relatively simple structure.

Abstract: A checking unit includes a power net extractor for extracting a power net with power attribution, which is segmented by a power-decoupling element, with reference to circuit design data of a printed wiring board; a parts number extractor for extracting a parts number of an integrated circuit connected to the extracted power net; a parts headcount calculator for calculating a headcount of the extracted parts; a judging unit for comparing the extracted parts headcount with a predetermined reference value; and a representing unit for representing a name of the power net and the parts number of the integrated circuit as an unprocessed location of power decoupling when the headcount is larger than the reference value, thereby inspecting quickly whether a power supply in use, shared by each of the integrated circuits, is decoupled at higher frequencies by the power-decoupling element.

Abstract: A management information display unit that is able to form management information for managing the power supply state of fuel cells and displays the management information while allowing the management information to be identified as to which electronic device pertains to the management information based on identification information inputted from a plurality of electronic devices that are able to output the formed management information in correlation with the identification information of the fuel cell, and an information transmitting part for transmitting the identification information and the management information while allowing the information to be inputted to the management information display unit are provided.

Abstract: The heatsink structure for solid-state image sensors comprises a foil-like heatsink sheet made of a high heat conductivity material, the heatsink sheet having a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member, and having a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the invention realizes a heatsink structure for cooling the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure.

Abstract: In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.

Abstract: A printed wiring board design method including the steps of designing placement and wiring for circuit components based on circuit information on a mounting surface of the board; excluding a placement region and a wiring region for the circuit components from the mounting surface to thereby calculate a placement and wiring enable region for an EMC component in which the EMC component can be placed and wiring can be laid down; and calculating the placement and wiring range for the EMC component based on an EMC design rule from the calculated placement and wiring enable region for the EMC component. Thus, a printed wiring board design method is provided in which placement of and wiring for a new bypass capacitor or the like can be implemented and a region satisfying restraint items from the design rule can be clearly displayed as a new input enable region on a CAD screen.

Abstract: A CAD apparatus designing patterns of a printed board. The apparatus includes a signal wiring pattern detecting unit for detecting a signal wiring pattern, and a guard ground detecting unit for tracing the signal wiring pattern along the longitudinal direction thereof, in order to detect whether or not a guard ground exists within a distance from the signal wiring pattern to a predetermined first discriminant value, identify a non-guard ground section within the distance to the first discriminant value, and to detect whether or not a guard ground exists within another distance from the signal wiring pattern to a second discriminant value, which is larger than the first discriminant value. The apparatus also includes a return path judging unit for judging an error of guard ground when no guard ground exists within the distance to the second discriminant value, thereby quickly checking a return path without mistake.

Abstract: An element placement check system for checking element placement on a printed wiring board having wiring by which a power supply terminal of an integrated circuit and a power supply decoupling element for the power supply terminal are connected on a mounting surface on which the integrated circuit is mounted, wherein the wiring is connected to a power supply plane for providing a direct current power supply to the power supply terminal through a power supply via hole, including: element distance detecting means detecting a first wire length between the power supply decoupling element and the power supply terminal; power supply via hole distance detecting means detecting a second wire length between the power supply via hole and the power supply terminal; and determination means determining a positional relationship of the power supply decoupling element and the power supply via hole to the power supply terminal based on the first and second wire lengths, thereby providing a check system and a printed wiring b

Abstract: A checking unit includes a power net extracting means for extracting a power net with power attribution, which is segmented by a power-decoupling element, with reference to circuit design data of the printed wiring board; a parts number extracting means for extracting a parts number of an integrated circuit which is connected to the extracted power net; a parts headcount calculating means for calculating a headcount of the extracted parts; a judging means for comparing the extracted parts headcount with a predetermined reference value; and a representing means for representing a name of the power net and the parts number of the integrated circuit as an unprocessed location of power decoupling when the headcount is larger than the reference value, whereby inspecting quickly whether or not a power supply in use, which is shared by each of the integrated circuits, is decoupled at higher frequencies by the power-decoupling element.

Abstract: A CAD apparatus for designing patterns of a printed board, includes: a signal wiring pattern detecting unit 22 for detecting a signal wiring pattern with reference to wiring information of the printed board; a guard ground detecting unit 23 for tracing the signal wiring pattern along the longitudinal direction thereof, to detect whether or not a guard ground exists within a distance from the signal wiring pattern to a predetermined first discriminant value GL, and for identifying a non-guard ground section in which no guard ground exists within the distance to the first discriminant value GL, and for detecting whether or not a guard ground exists within another distance from the signal wiring pattern to a second discriminant value GU, which is larger than the first discriminant value GL, in the non-guard ground section; and a return path judging unit 25 for judging an error of guard ground when no guard ground exists within the distance to the second discriminant value GU in the non-guard ground section, ther

Abstract: An element placement check system for checking element placement on a printed wiring board having wiring by which a power supply terminal of an integrated circuit and a power supply decoupling element for the power supply terminal are connected on a mounting surface on which the integrated circuit is mounted, wherein the wiring is connected to a power supply plane for providing a direct current power supply to the power supply terminal through a power supply via hole, including: element distance detecting means detecting a first wire length between the power supply decoupling element and the power supply terminal; power supply via hole distance detecting means detecting a second wire length between the power supply via hole and the power supply terminal; and determination means determining a positional relationship of the power supply decoupling element and the power supply via hole to the power supply terminal based on the first and second wire lengths, thereby providing a check system and a printed wiring b

Abstract: A printed wiring board design method including the steps of designing placement and wiring for circuit components based on circuit information on a mounting surface of the board; excluding a placement region and a wiring region for the circuit components from the mounting surface to thereby calculate a placement and wiring enable region for an EMC component in which the EMC component can be placed and wiring can be laid down; and calculating the placement and wiring range for the EMC component based on an EMC design rule from the calculated placement and wiring enable region for the EMC component, thereby providing a printed wiring board design method in which a placement of and wiring for a new bypass capacitor or the like can be implemented and a region satisfying restraint items from the design rule can be clearly displayed as a new input enable region on a CAD screen.

Abstract: A management information display unit that is able to form management information for managing the power supply state of fuel cells and displays the management information while allowing the management information to be identified as to which electronic device of the electronic devices pertains to the management information on basis of identification information inputted from a plurality of electronic devices that are able to output the formed management information in correlation with the identification information of the fuel cell, and information transmitting part for transmitting the identification information and the management information while allowing the information to be inputted to the management information display unit are provided.