Patents by Inventor Miyoshi Watanabe

Miyoshi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8872063
    Abstract: The present invention provides a method for producing a blank printing sleeve for laser engraving, comprising: (1) a step of laminating a photosensitive resin composition layer (a) on a hollow cylindrical support (b); (2) a step of photo-curing the laminated photosensitive resin composition layer (a) to form a cured photosensitive resin layer (c); and (3) a step of cutting the hollow cylindrical support (b) and the cured photosensitive resin layer (c) approximately in a circumferential direction of the hollow cylindrical support (b) by a laser cutting method and/or a water beam cutting method.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: October 28, 2014
    Assignee: Asahi Kasei E-Materials Corporation
    Inventors: Hiroshi Yamada, Miyoshi Watanabe
  • Publication number: 20110198323
    Abstract: The present invention provides a method for producing a blank printing sleeve for laser engraving, comprising: (1) a step of laminating a photosensitive resin composition layer (a) on a hollow cylindrical support (b); (2) a step of photo-curing the laminated photosensitive resin composition layer (a) to form a cured photosensitive resin layer (c); and (3) a step of cutting the hollow cylindrical support (b) and the cured photosensitive resin layer (c) approximately in a circumferential direction of the hollow cylindrical support (b) by a laser cutting method and/or a water beam cutting method.
    Type: Application
    Filed: June 12, 2009
    Publication date: August 18, 2011
    Inventors: Hiroshi Yamada, Miyoshi Watanabe
  • Patent number: 7997199
    Abstract: A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: August 16, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Miyoshi Watanabe, Tomohiro Kishida
  • Publication number: 20100189916
    Abstract: The present invention has an object to provide a cylindrical printing substrate having a highly accurate thickness and surface smoothness suitable for printing.
    Type: Application
    Filed: August 9, 2007
    Publication date: July 29, 2010
    Inventor: Miyoshi Watanabe
  • Patent number: 7754415
    Abstract: A process for producing a laser engravable printing substrate, comprising the step of forming a layer of photosensitive resin composition on a cylindrical support or sheeted support and the step of irradiating the formed layer of photosensitive resin composition with light to thereby provide a layer of cured photosensitive resin of 50 ?m to 50 mm thickness, wherein the light for irradiation of the photosensitive resin composition layer contains a ray of 200 to 450 nm wavelength and wherein the light illuminance on the surface of the photosensitive resin composition layer is in the range of 20 mW/cm2 to 2 W/cm2 when measured with the use of UV meter (trade name “UV-M02” manufactured by Ohku Seisakusho) and filter (trade name “UV-35-APR Filter” manufactured by Ohku Seisakusho) and in the range of 3 mW/cm2 to 2 W/cm2 when measured with the use of the above UV meter and filter (trade name “UV-25 Filter” manufactured by Ohku Seisakusho).
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: July 13, 2010
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Hiroshi Yamada, Kei Tomeba, Miyoshi Watanabe
  • Patent number: 7709183
    Abstract: A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: May 4, 2010
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Miyoshi Watanabe, Tomohiro Kishida
  • Publication number: 20090126588
    Abstract: A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.
    Type: Application
    Filed: June 10, 2008
    Publication date: May 21, 2009
    Inventors: Miyoshi Watanabe, Tomohiro Kishida
  • Publication number: 20070178408
    Abstract: A process for producing a laser engravable printing substrate, comprising the step of forming a layer of photosensitive resin composition on a cylindrical support or sheeted support and the step of irradiating the formed layer of photosensitive resin composition with light to thereby provide a layer of cured photosensitive resin of 50 ?m to 50 mm thickness, wherein the light for irradiation of the photosensitive resin composition layer contains a ray of 200 to 450 nm wavelength and wherein the light illuminance on the surface of the photosensitive resin composition layer is in the range of 20 mW/cm2 to 2 W/cm2 when measured with the use of UV meter (trade name “UV-M02” manufactured by Ohku Seisakusho) and filter (trade name “UV-35-APR Filter” manufactured by Ohku Seisakusho) and in the range of 3 mW/cm2 to 2 W/cm2 when measured with the use of the above UV meter and filter (trade name “UV-25 Filter” manufactured by Ohku Seisakusho).
    Type: Application
    Filed: January 26, 2005
    Publication date: August 2, 2007
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Hiroshi Yamada, Kei Tomeba, Miyoshi Watanabe
  • Publication number: 20060230964
    Abstract: A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.
    Type: Application
    Filed: April 30, 2004
    Publication date: October 19, 2006
    Inventors: Miyoshi Watanabe, Tomohiro Kishida
  • Patent number: 6305284
    Abstract: The present invention concerns a plate making method of forming an image on a heat sensitive blank plate by a multichannel method using a plate making apparatus of an outer surface cylinder scanning type. A blank plate (400) is secured to the outer circumferential surface of a hollow cylinder (131). A laser beam (800) is irradiated from an optical head (150) onto the blank plate (400). The laser beam (800) is a beam group consisting of a plurality of infrared laser beams arranged in a line.
    Type: Grant
    Filed: February 15, 2000
    Date of Patent: October 23, 2001
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Miyoshi Watanabe, Masami Mochizuki