Patents by Inventor Miyuki Akimoto

Miyuki Akimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240321903
    Abstract: The semiconductor device includes a driver circuit portion including a driver circuit and a pixel portion including a pixel. The pixel includes a gate electrode layer having a light-transmitting property, a gate insulating layer, a source electrode layer and a drain electrode layer each having a light-transmitting property provided over the gate insulating layer, an oxide semiconductor layer covering top surfaces and side surfaces of the source electrode layer and the drain electrode layer and provided over the gate electrode layer with the gate insulating layer therebetween, a conductive layer provided over part of the oxide semiconductor layer and having a lower resistance than the source electrode layer and the drain electrode layer, and an oxide insulating layer in contact with part of the oxide semiconductor layer.
    Type: Application
    Filed: May 30, 2024
    Publication date: September 26, 2024
    Inventors: Masayuki SAKAKURA, Yoshiaki OIKAWA, Shunpei YAMAZAKI, Junichiro SAKATA, Masashi TSUBUKU, Kengo AKIMOTO, Miyuki HOSOBA
  • Patent number: 7093717
    Abstract: The object of the invention is to construct a simple packaging structure having few components and capable of protecting a contained product against shock impacts coming from all directions. To this end, the packaging structure according to the present invention is made of synthetic resin with an elastic quality molded into a sheet form, and includes a first tray pack and a second tray pack which face each other and are adjoined to hold the contained product securely in place; wherein the first and second tray packs are provided with sustaining portions sustaining the periphery of the contained product.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: August 22, 2006
    Assignee: Fujitsu Limited
    Inventors: Shuhei Sakai, Miyuki Akimoto, Katsuya Fujii, Hiroshi Katagiri, Kiyonori Kusuda
  • Publication number: 20030146128
    Abstract: The object of the invention is to construct a simple packaging structure having few components and capable of protecting a contained product against shock impacts coming from all directions. To this end, the packaging structure according to the present invention is made of synthetic resin with an elastic quality molded into a sheet form, and includes a first tray pack and a second tray pack which face each other and are adjoined to hold the contained product securely in place; wherein the first and second tray packs are provided with sustaining portions sustaining the periphery of the contained product.
    Type: Application
    Filed: October 10, 2002
    Publication date: August 7, 2003
    Inventors: Shuhei Sakai, Miyuki Akimoto, Katsuya Fujii, Hiroshi Katagiri, Kiyonori Kusuda