Abstract: The invention relates to a thermally conductive, electrically conductive adhesive composition including: (A) an electrically conductive filler, (B) an epoxy resin, and (C) a curing agent. The electrically conductive filler (A) is a submicron fine silver powder, and the content of the fine silver powder is 75 to 94% by mass of the total amount of the adhesive composition. The content of the epoxy resin (B) is 5 to 20% by mass of the total amount of the adhesive composition. The curing agent (C) is a compound of Formula (I), (II), or (III), as defined herein, and the content of the compound is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).

Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (a) of orientation in a range of 0.5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5×10?6 to 50×10?6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30×10?6 (/K) or less.

Abstract: A thermally-conductive epoxy resin molded article comprises an epoxy resin having molecular chains that contain an azomethine group (—CH═N—). The molded article has a thermal conductivity in a range of 0.5 to 30 W/(m·K). It is preferred that the molecular chains of the epoxy resin are oriented in a specific direction, and in that direction, the molded article has a thermal conductivity in a range of 0.5 to 30 W/(m·K). The thermally-conductive epoxy resin molded article is produced by applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction and then curing the epoxy resin composition.