Abstract: Provided is a method of manufacturing a MEMS device including forming, in a metal layer, an opening that enables a first space and a second space to communicate with each other by exposing the metal layer to an etching solution in a state where the metal layer is left at a boundary between the first space and the second space, and covering an inner surface of an opening of each of an adhesive layer and the metal layer by forming a protective layer from an inner surface of the first space to an inner surface of the second space after the opening of the metal layer is formed.

Abstract: A liquid ejecting head includes a piezoelectric element which includes a piezoelectric layer, and a first electrode and a second electrode sandwiching the piezoelectric layer therebetween, a leading-out wiring provided on an upper portion of the piezoelectric element and including a wiring layer made of gold or platinum and an underlayer which are patterned, and an insulating protective film which covers at least an exposed portion on the underlayer of the leading-out wiring.

Abstract: A liquid ejecting head includes a piezoelectric element which includes a piezoelectric layer, and a first electrode and a second electrode sandwiching the piezoelectric layer therebetween, a leading-out wiring provided on an upper portion of the piezoelectric element and including a wiring layer made of gold or platinum and an underlayer which are patterned, and an insulating protective film which covers at least an exposed portion on the underlayer of the leading-out wiring.

Abstract: Provided is a method of manufacturing a MEMS device including forming, in a metal layer, an opening that enables a first space and a second space to communicate with each other by exposing the metal layer to an etching solution in a state where the metal layer is left at a boundary between the first space and the second space, and covering an inner surface of an opening of each of an adhesive layer and the metal layer by forming a protective layer from an inner surface of the first space to an inner surface of the second space after the opening of the metal layer is formed.

Abstract: A lower electrode, which partially constitutes a piezoelectric element, is patterned such that at least one end face thereof is located in a region facing a corresponding pressure generating chamber. A piezoelectric layer includes a plurality of layers of ferroelectric films. A first ferroelectric film, which is a lowermost layer of the plurality of layers of ferroelectric films, is provided only on the lower electrode such that an end face thereof is aligned with the end face of the lower electrode. The end face of the first ferroelectric film and the end face of the lower electrode are sloped at an angle of 10° to 50° with respect to a vibration plate. Other ferroelectric films formed on the first ferroelectric film are provided in such a manner as to overlie the sloped end face of the lower electrode and the sloped end face of the first ferroelectric film.

Abstract: A lower electrode, which partially constitutes a piezoelectric element, is patterned such that at least one end face thereof is located in a region facing a corresponding pressure generating chamber. A piezoelectric layer comprises a plurality of layers of ferroelectric films. A first ferroelectric film, which is a lowermost layer of the plurality of layers of ferroelectric films, is provided only on the lower electrode such that an end face thereof is aligned with the end face of the lower electrode. The end face of the first ferroelectric film and the end face of the lower electrode are sloped at an angle of 10° to 50° with respect to a vibration plate. Other ferroelectric films formed on the first ferroelectric film are provided in such a manner as to overlie the sloped end face of the lower electrode and the sloped end face of the first ferroelectric film.