Abstract: A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C): (A) a silicone-modified epoxy resin having a cyclic siloxane structure, (B) a silicone-modified epoxy resin having a branched siloxane structure, and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.

Abstract: A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): wherein R1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group having a norbornane epoxy structure, or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R1s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group having a norbornane epoxy structure.

Abstract: The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.

Abstract: An epoxy resin represented by the following formula (1) wherein R1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R1, R2, R3, k, or m present in the formula may be the same or different from each other.

Abstract: An addition-curable silicone resin composition includes (A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (A-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal SiH group per molecule of 5 wt % or less, and (C) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on LED chips and imparts a good wire bondability.

Abstract: A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): wherein R1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group having a norbornane epoxy structure, or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R1s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group having a norbornane epoxy structure.

Abstract: The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.

Abstract: An addition-curable silicone resin composition includes (A-1) a linear organopolysiloxane having at least two alkenyl groups per molecule, (A-2) a terminal alkenyl group-containing branched organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane with a content of low-molecular-weight siloxane having a degree of polymerization of up to 10 and one or more terminal SiH group per molecule of 5 wt % or less, and (C) an addition reaction catalyst. The composition can be cured to form a product which, when used as a die attach material for optical semiconductor devices, minimizes contamination of the gold electrode pads on LED chips and imparts a good wire bondability.

Abstract: Problem to be Solved The purpose of the invention, in view of the above circumstances, is to provide a silicone-modified epoxy resin composition that offers a cured article excellent in low gas permeability and strength, and an epoxy resin cured article obtained by curing the composition. Solution An epoxy resin represented by the following formula (1) wherein R1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R1, R2, R3, k, or m present in the formula may be the same or different from each other.

Abstract: A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C): (A) a silicone-modified epoxy resin having a cyclic siloxane structure, (B) a silicone-modified epoxy resin having a branched siloxane structure, and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.

Abstract: A wavelength conversion sheet filled with a large amount of phosphor, enabling the phosphor to be easily dispersed uniformly and in a large amount near the surface of an LED element. Specifically, the sheet includes: a layer formed from a heat-curable resin composition, which contains 100 parts by mass of a resin component and 100 to 2,000 parts by mass of a particulate phosphor in which the proportion of particles having a sphericity of 0.7 to 1.0 is not less than 60% of all the particles, and which exists in a plastic solid or semisolid state in an uncured state at normal temperature, wherein the average particle diameter of the phosphor is not more than 60% of the thickness of the layer formed from the heat-curable resin composition, and the maximum particle diameter thereof is not more than 90% thereof.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: A cured thin film may be easily prepared, by curing a photocurable silicone resin composition containing: (A) an organopolysiloxane having two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, and (C) a photoactive catalyst, by: (i) applying the composition to a substrate, (ii) obtaining a thin film in a semi-cured state by irradiating the applied coating with light, and (iii) heating the thin film in a semi-cured state to achieve complete curing, wherein the spectrum of the light irradiated in step (ii) has a maximum peak in a wavelength region from 300 nm to 400 nm, and the spectral irradiance of light of any wavelength within the wavelength region shorter than 300 nm is not more than 5% of the spectral irradiance of light of the maximum peak wavelength.

Abstract: A method for curing a silicone resin composition with heat, wherein the silicone resin composition comprises (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxnae having, per molecule, at least two hydrogen atoms each bonded to a silicon atom, and (C) a photoactive catalyst, wherein the method is characterized by comprising a step of irradiating the silicone resin composition with light before a step of heating, the light has a maximum peak of irradiance in a region of wavelengths of 300 to 400 nm and an irradiance of light of wavelength shorter than 300 nm is 5% or less of the irradiance at the maximum peak.

Abstract: A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1?a+b, and c represents an integer of 0 to 10 wherein, R3 represents an alkylene group of 2 to 12 carbon atoms wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.

Abstract: A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 ?m, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.

Abstract: A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.

Abstract: An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1?a+b, and c represents an integer of 0 to 10. wherein, R3 represents an alkylene group of 2 to 12 carbon atoms. wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.