Abstract: A developing device includes: a case in which a hollow transporting path is formed; a transporting member configured to transport a developer in the transporting path; a support portion fixed to an end portion of the case by a fastening member to support the transporting member at an end portion of the transporting path; and a cooling unit fixed by being sandwiched between the support portion and the case.

Abstract: Provided is a developing device having a first transport member and a second transport member that are disposed in a first transport path and a second transport path provided at an upper side and a lower side in a gravitational direction. The transport members transport a developer so as to cause the developer to circulate between the first transport path and the second transport path. A partition wall that separates the first transport path and the second transport path from each other and has an opening including an open-close member that opens and closes the opening.

Abstract: Provided is a developing device having a first transport member and a second transport member that are disposed in a first transport path and a second transport path provided at an upper side and a lower side in a gravitational direction. The transport members transport a developer so as to cause the developer to circulate between the first transport path and the second transport path. A partition wall that separates the first transport path and the second transport path from each other and has an opening including an open-close member that opens and closes the opening.

Abstract: A developing device includes: a case in which a hollow transporting path is formed; a transporting member configured to transport a developer in the transporting path; a support portion fixed to an end portion of the case by a fastening member to support the transporting member at an end portion of the transporting path; and a cooling unit fixed by being sandwiched between the support portion and the case.

Abstract: A semiconductor layout design apparatus has an inter-block connection information extracting part, a cell initial placement part and an evaluation value. The inter-block connection information extracting part configured to extract the number of wiring connections between a plurality of blocks including standard cells and macrocells based on a net list, library information, floor plan information and technology information. The cell initial placement part configured to initially place the standard cells and the macrocells in an placement region to generate an initial floor plan. The evaluation value calculating part configured to calculate an evaluation value of the floor plan based on distances between a plurality of blocks including the standard cells and the macrocells initially placed by the cell initial placement part and the extracted number of the wiring connections between a plurality of blocks.

Abstract: A semiconductor layout design apparatus has an inter-block connection information extracting part, a block global placement part and a cell placement setting part. The inter-block connection information extracting part configured to extract the number of wiring connections between a plurality of blocks including standard cells and macrocells based on a net list, library information, floor plan information and technology information. The block global placement part configured to roughly place the plurality of blocks in a placement region on a semiconductor substrate. The cell placement setting part configured to set placement positions of the macrocells in the block based on a positioning relationship with the other block and the number of the wiring connections with the other block with respect to each of the plurality of blocks roughly placed by the block global placement part.

Abstract: A semiconductor layout design apparatus has an inter-block connection information extracting part, a block global placement part and a cell placement setting part. The inter-block connection information extracting part configured to extract the number of wiring connections between a plurality of blocks including standard cells and macrocells based on a net list, library information, floor plan information and technology information. The block global placement part configured to roughly place the plurality of blocks in a placement region on a semiconductor substrate. The cell placement setting part configured to set placement positions of the macrocells in the block based on a positioning relationship with the other block and the number of the wiring connections with the other block with respect to each of the plurality of blocks roughly placed by the block global placement part.

Abstract: A semiconductor layout design apparatus has an inter-block connection information extracting part, a cell initial placement part and an evaluation value. The inter-block connection information extracting part configured to extract the number of wiring connections between a plurality of blocks including standard cells and macrocells based on a net list, library information, floor plan information and technology information. The cell initial placement part configured to initially place the standard cells and the macrocells in an placement region to generate an initial floor plan. The evaluation value calculating part configured to calculate an evaluation value of the floor plan based on distances between a plurality of blocks including the standard cells and the macrocells initially placed by the cell initial placement part and the extracted number of the wiring connections between a plurality of blocks.