Abstract: The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200° C. to 450° C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.

Abstract: In an aspect, the present disclosure relates to a polyamide solution including aromatic polyamide and a solvent. A dimension change gap between a cast film of the polyamide solution and the cast film after being subjected to a heat treatment is not more than a predetermined value. In another aspect, the present disclosure relates to a method for manufacturing a display element, an optical element, an illumination element or a sensor element, including a step of forming a polyamide film by using the polyamide solution.

Abstract: Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a polymer and a solvent dissolving the polymer. The resin composition is used to form a layer, and when refractive indexes of the layer along two perpendicular in-plane directions thereof are respectively defined as “Nx” and “Ny” and a refractive index of the layer along a thickness direction thereof is defined as “Nz”, Nx, Ny and Nz satisfy a relationship of “(Nx+Ny)/2?Nz”>0.01. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.

Abstract: Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device including a transparent resin film having an excellent display property, a method of manufacturing such a resin composition and a method of manufacturing the electronic device using such a substrate and the electronic device. The resin composition of the present invention contains an aromatic polyamide, an aromatic multifunctional compound having two or more functional groups including a carboxyl group or an amino group, and a solvent dissolving the aromatic polyamide.

Abstract: The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200° C. to 450° C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.

Abstract: Provided are a resin composition and a substrate that are capable of being used for producing an electronic device including thin-film transistors having an excellent switching property. The resin composition contains an aromatic polyamide and a solvent dissolving the aromatic polyamide. The resin composition is used to form a layer, and a total light transmittance of the layer in a wavelength of 355 nm is 10% or less. Further, a method of manufacturing the electronic device using such a substrate is also provided.

Abstract: This disclosure, in one or plurality of embodiments, relates to a solution of polyamide from which a cast film with low CTE and Rth can be achieved. This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; inorganic filler; and a solvent. This disclosure, viewed from one aspect, relates to a laminated composite material, comprising a base, and a polyamide resin layer: wherein the polyamide resin layer is laminated to one surface of the base; and wherein the polyamide resin layer is obtained or obtainable by applying a polyamide solution comprising an aromatic polyamide, an inorganic filler and a solvent onto the base.

Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; and a solvent; wherein elastic modulus at 30.0° C. of a cast film formed by applying the solution onto a glass plate is 5.0 GPa or less, and coefficient of thermal expansion (CTE) of the cast film is more than 30 ppm/K, and wherein the aromatic copolyamide comprises at least two repeat units, and at least one of the repeat units has one or more free carboxyl groups.

Abstract: This disclosure, in one aspect, relates to a solution of polyamide including an aromatic polyamide and an amphiphilic solvent. This disclosure, in another aspect, relates to a solution of polyamide including an aromatic polyamide, an amphiphilic solvent, and an aprotic solvent. This disclosure, in another aspect, relates to a solution of aromatic polyamide for producing a display element, an optical element or an illumination element.

Abstract: This disclosure, viewed from one aspect, relates to a laminated composite material, including a glass plate and an organic resin layer. The organic resin layer is laminated on one surface of the glass plate, the organic resin is a polyamide resin, the rate of mass change of the polyamide resin from 300° C. to 400° C. measured by thermo gravimetry (TG) is 3.0% or less, and the glass transition temperature of the polyamide resin is 300° C. or more.

Abstract: This disclosure, viewed from one aspect, this disclosure relates to a solution of polyamide comprising: an aromatic polyamide, a silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.

Abstract: The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant.

Abstract: The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant.