Patents by Inventor Mizuho Ishikawa
Mizuho Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113732Abstract: A communication circuit includes a transmission terminal to which a transmission signal is supplied, a first duplexer that has a transmission node, a reception node, and a common node, a first filter that has a first end part electrically connected to the common node of the first duplexer and a second end part electrically connected to an antenna terminal, a first auxiliary output terminal that outputs the transmission signal to an external circuit, an inductor that is part of a second filter and has a first end part and a second end part that is electrically connected to the first auxiliary output terminal, and a first switch that switches the electrical connection destination of the transmission terminal between the transmission node of the first duplexer and the first end part of the inductor.Type: ApplicationFiled: September 21, 2023Publication date: April 4, 2024Applicant: Murata Manufacturing Co., Ltd.Inventor: Mizuho ISHIKAWA
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Patent number: 11855677Abstract: A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.Type: GrantFiled: October 3, 2022Date of Patent: December 26, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Syunji Yoshimi, Mizuho Ishikawa
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Patent number: 11601153Abstract: A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.Type: GrantFiled: April 1, 2020Date of Patent: March 7, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Syunji Yoshimi, Mizuho Ishikawa
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Publication number: 20230027206Abstract: A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.Type: ApplicationFiled: October 3, 2022Publication date: January 26, 2023Inventors: Syunji YOSHIMI, Mizuho ISHIKAWA
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Patent number: 11463120Abstract: A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.Type: GrantFiled: April 1, 2020Date of Patent: October 4, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Syunji Yoshimi, Mizuho Ishikawa
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Publication number: 20220270962Abstract: A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 ?m or less.Type: ApplicationFiled: March 4, 2022Publication date: August 25, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Mizuho ISHIKAWA, Kazuhiro UEDA
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Patent number: 11289415Abstract: A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 ?m or less.Type: GrantFiled: September 30, 2019Date of Patent: March 29, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Mizuho Ishikawa, Kazuhiro Ueda
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Patent number: 10892720Abstract: A control circuit includes a first output unit configured to output a constant bias current for setting an electrical bias state of a bias circuit to the bias circuit; a second output unit configured to output a bias control current or constant voltage for controlling the electrical bias state of the bias circuit to the bias circuit; a resistor having one end connected to a reference potential; and a switch provided between another end of the resistor and an output terminal of the second output unit.Type: GrantFiled: March 26, 2019Date of Patent: January 12, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takeyuki Okabe, Fuminori Morisawa, Mizuho Ishikawa, Yuri Honda
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Patent number: 10848105Abstract: A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level, and that supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level, and that outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.Type: GrantFiled: October 1, 2019Date of Patent: November 24, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Mizuho Ishikawa, Satoshi Sakurai
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Publication number: 20200321997Abstract: A high-frequency signal transmission-reception circuit includes a plurality of band pass filter groups each including a plurality of band pass filter pairs; a first switch including a plurality of band pass filter-side terminal groups each including a plurality of band pass filter-side terminals, and an antenna-side terminal group; a plurality of couplers configured to output respective signal strengths of high-frequency signals transmitted on a plurality of transmission paths; and a second switch including an input terminal group electrically connected to the plurality of couplers, and an output terminal configured to output a detection signal output from one of the plurality of couplers. The first switch electrically connects one band pass filter-side terminal in one band pass filter-side terminal group and one antenna-side terminal, and also electrically connects one band pass filter-side terminal in another band pass filter-side terminal group and another antenna-side terminal.Type: ApplicationFiled: April 1, 2020Publication date: October 8, 2020Inventors: Syunji YOSHIMI, Mizuho ISHIKAWA
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Publication number: 20200111731Abstract: A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 ?m or less.Type: ApplicationFiled: September 30, 2019Publication date: April 9, 2020Applicant: Murata Manufacturing Co., Ltd.Inventors: Mizuho ISHIKAWA, Kazuhiro UEDA
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Publication number: 20200036342Abstract: A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level, and that supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level, and that outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.Type: ApplicationFiled: October 1, 2019Publication date: January 30, 2020Inventors: Mizuho Ishikawa, Satoshi Sakurai
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Patent number: 10469033Abstract: A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level, and that supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level, and that outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.Type: GrantFiled: October 25, 2018Date of Patent: November 5, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Mizuho Ishikawa, Satoshi Sakurai
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Publication number: 20190326865Abstract: A control circuit includes a first output unit configured to output a constant bias current for setting an electrical bias state of a bias circuit to the bias circuit; a second output unit configured to output a bias control current or constant voltage for controlling the electrical bias state of the bias circuit to the bias circuit; a resistor having one end connected to a reference potential; and a switch provided between another end of the resistor and an output terminal of the second output unit.Type: ApplicationFiled: March 26, 2019Publication date: October 24, 2019Inventors: Takeyuki OKABE, Fuminori MORISAWA, Mizuho ISHIKAWA, Yuri HONDA
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Publication number: 20190068127Abstract: A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level, and that supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level, and that outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.Type: ApplicationFiled: October 25, 2018Publication date: February 28, 2019Inventors: Mizuho ISHIKAWA, Satoshi SAKURAI
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Patent number: 10135398Abstract: A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level and supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level and outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.Type: GrantFiled: November 16, 2017Date of Patent: November 20, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Mizuho Ishikawa, Satoshi Sakurai
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Publication number: 20180145635Abstract: A power amplification module includes first and second amplifiers for first and second communication modes, a bypass line that bypasses the first or second amplifier, an input switch circuit that supplies a radio frequency signal to the first or second amplifier in accordance with a communication mode when a desired output level is equal to or greater than a reference level and supplies a radio frequency signal to the bypass line when the desired output level is less than the reference level, and an output switch circuit that outputs a first amplified signal from the first amplifier or a second amplified signal from the second amplifier in accordance with the communication mode when the desired output level is equal to or greater than the reference level and outputs a radio frequency signal output from the bypass line when the desired output level is less than the reference level.Type: ApplicationFiled: November 16, 2017Publication date: May 24, 2018Inventors: Mizuho Ishikawa, Satoshi Sakurai
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Patent number: 9636346Abstract: The purpose of the present invention is to provide a pharmaceutical composition that is useful for the treatment of diseases that are caused by an increase in bone resorption and that does not cause serious side effects even when used in combination with another drug. The present invention relates to: an ?-oxoacyl amino-caprolactam derivative that is represented by formula (I) (in the formula, X is —O— or —N(R1)— and R1 represents an alkoxycarbonyl group having 1-10 carbon atoms); and a bone resorption inhibitor containing the ?-oxoacyl amino-caprolactam derivative.Type: GrantFiled: September 13, 2016Date of Patent: May 2, 2017Assignee: Seikagaku CorporationInventors: Nobuo Kobayashi, Tsuneo Koji, Hisatomo Kunii, Mizuho Ishikawa, Daisuke Morita
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Patent number: 9562042Abstract: The purpose of the present invention is to provide a pharmaceutical composition that is useful for the treatment of diseases that are caused by an increase in bone resorption and that does not cause serious side effects even when used in combination with another drug. The present invention relates to: an ?-oxoacyl amino-caprolactam that is represented by formula (I) (in formula (I), X represents N or CH, Y represents O or CH2, and Z represents S or CH2); and a bone resorption inhibitor containing the ?-oxoacyl amino-caprolactam.Type: GrantFiled: June 13, 2014Date of Patent: February 7, 2017Assignee: Seikagaku CorporationInventors: Nobuo Kobayashi, Tsuneo Koji, Hisatomo Kunii, Mizuho Ishikawa, Daisuke Morita
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Publication number: 20160375031Abstract: The purpose of the present invention is to provide a pharmaceutical composition that is useful for the treatment of diseases that are caused by an increase in bone resorption and that does not cause serious side effects even when used in combination with another drug. The present invention relates to: an ?-oxoacyl amino-caprolactam derivative that is represented by formula (I) (in the formula, X is —O— or —N(R1)— and R1 represents an alkoxycarbonyl group having 1-10 carbon atoms); and a bone resorption inhibitor containing the ?-oxoacyl amino-caprolactam derivative.Type: ApplicationFiled: September 13, 2016Publication date: December 29, 2016Inventors: Nobuo Kobayashi, Tsuneo Koji, Hisatomo Kunii, Mizuho Ishikawa, Daisuke Morita