Abstract: The present invention relates to a method for producing a hydrogenated block copolymer, including the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a tetra- or more functional silane coupling agent; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; (c) isolating the resultant hydrogenated block copolymer; and (d) deactivating a functional group in the silane coupling agent and/or an unreacted functional group present in a coupling agent residue in the block copolymer or the hydrogenated block copolymer prior to the step (c), in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer recovered in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

Abstract: The present invention relates to a method for producing a hydrogenated block copolymer, including the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a tetra- or more functional silane coupling agent; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; (c) isolating the resultant hydrogenated block copolymer; and (d) deactivating a functional group in the silane coupling agent and/or an unreacted functional group present in a coupling agent residue in the block copolymer or the hydrogenated block copolymer prior to the step (c), in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer recovered in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

Abstract: The present invention relates to a method for producing a hydrogenated block copolymer, including the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a tetra- or more functional silane coupling agent; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; (c) isolating the resultant hydrogenated block copolymer; and (d) deactivating a functional group in the silane coupling agent and/or an unreacted functional group present in a coupling agent residue in the block copolymer or the hydrogenated block copolymer prior to the step (c), in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer recovered in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

Abstract: The present invention relates to a method for producing a hydrogenated block copolymer, comprises the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a bis-silane coupling agent having a specific structure; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; and (c) isolating the resultant hydrogenated block copolymer, in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer isolated in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

Abstract: The present invention relates to a method for producing a hydrogenated block copolymer, comprises the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a bis-silane coupling agent having a specific structure; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; and (c) isolating the resultant hydrogenated block copolymer, in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer isolated in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

Abstract: The present invention relates to a method for producing a hydrogenated block copolymer, including the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a tetra- or more functional silane coupling agent; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; (c) isolating the resultant hydrogenated block copolymer; and (d) deactivating a functional group in the silane coupling agent and/or an unreacted functional group present in a coupling agent residue in the block copolymer or the hydrogenated block copolymer prior to the step (c), in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer recovered in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

Abstract: A polyolefin-based resin composition of the invention has an addition polymerization-based block copolymer (I) and a polyolefin-based resin (II). The addition polymerization-based block copolymer (I) is selected from block copolymers comprising at least one polymer block A and at least one polymer block B, and the hydrogenated products thereof. The polymer block A comprises an aromatic vinyl compound unit comprising at least 1% by mass of an alkylstyrene-derived structural unit (a), in which at least one alkyl group having 1 to 8 carbon atoms is bound to a benzene ring. The polymer block B comprises a conjugated diene compound unit. A moiety of polymer block A can undergo crosslinking upon exposure to an active energy ray. After being molded into a desired shape, the composition is exposed to an active energy ray to carry out the crosslinking reaction. The composition exhibits flexibility, heat resistance, mechanical properties and solvent resistance in a well-balanced manner.

Abstract: A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.

Abstract: The invention provides a polymer composition containing an addition polymerization-based block copolymer (a), an acrylic resin (b), and a softener (c), wherein the addition polymerization-based block copolymer (a) has a weight average molecular weight of 30000 to 200000 and is at least one selected from block copolymers comprising at least one polymer block A and at least one polymer block B, and hydrogenated products of the block copolymers; the polymer block A essentially comprises an aromatic vinyl compound unit containing at least 1% by mass of an alkylstyrene-derived structural unit (I) in which at least one alkyl group having 1 to 8 carbon atoms is bound to a benzene ring; the block copolymer B comprises a conjugated diene compound unit; and the components of the polymer composition are present in respective proportions (by mass) so that the following relationships (1) and (2) hold: 0.05?Wb/Wa?2??(1) Wc/(Wa+Wb+Wc)?0.

Abstract: The present invention provides a resin composition having an oxygen scavenging function. The resin composition comprises 70 to 99.9 wt % of a polyvinyl alcohol resin (A) and 0.1 to 30 wt % of a thermoplastic resin (B) other than the polyvinyl alcohol resin (A), wherein the thermoplastic resin (B) has a carbon-carbon double bond and a functional group including a hetero atom, and an oxygen absorption rate of the resin composition is 0.001 ml/m2·day or more.

Abstract: An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.

Abstract: A curable resin composition includes (A) a cationically polymerizable-compound, (B) a cationic photopolymerization initiator, and (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000. The curable resin composition shows excellent elongation properties and high break elongation even in a cured state and can give a cured product having superior compatibility, transparency, flexibility and waterproofness. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.

Abstract: The invention provides a curable resin composition having an addition polymerization-based block copolymer (I) and an ethylenic unsaturated compound (II). Also provided is a flexographic plate material using the curable resin composition as its constituent. The flexographic plate material containing the curable resin composition of the present invention, can be cured to form strong and extendable areas and can be used to make flexographic plates that can form a sharp image plate surface even for a fine image. The flexographic plate material of the present invention is particularly useful in printing on cardboards, recycled paper or other paper articles with rough surfaces.

Abstract: The present invention provides a resin composition having an oxygen scavenging function. The resin composition comprises 70 to 99.9 wt % of a polyvinyl alcohol resin (A) and 0.1 to 30 wt % of a thermoplastic resin (B) other than the polyvinyl alcohol resin (A), wherein the thermoplastic resin (B) has a carbon-carbon double bond and a functional group including a hetero atom, and an oxygen absorption rate of the resin composition is 0.001 ml/m2·day or more.

Abstract: The present invention provides a resin composition having an oxygen scavenging function. The resin composition comprises 70 to 99.9 wt % of a polyvinyl alcohol resin (A) and 0.1 to 30 wt % of a thermoplastic resin (B) other than the polyvinyl alcohol resin (A), wherein the thermoplastic resin (B) has a carbon-carbon double bond and a functional group including a hetero atom, and an oxygen absorption rate of the resin composition is 0.001 ml/m2·day or more.

Abstract: The present invention concerns a polymer composition comprising: a block copolymer (a) including a polymer block A, which is composed mainly of an ?-methylstyrene, and a hydrogenated or unhydrogenated polymer block B, which is composed of a conjugated diene or isobutylene and has a weight average molecular weight of 30,000 to 200,000; an acrylic resin (b); and a softener (c), wherein proportions (by mass) of the respective components in the polymer composition are such that each of the following relationships (1) and (2) holds: 0.05?Wb/Wa?2 and??(1) Wc/(Wa+Wb+Wc)?0.5??(2) wherein Wa, Wb, and Wc represent amounts (by mass) of the block copolymer (a), the acrylic resin (b) and the softener (c), respectively.

Abstract: A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.

Abstract: A rubber composition includes (1) a diene rubber, (2) a silica and (3) an epoxidized liquid diene rubber having a number-average molecular weight of 10000 to 100000, wherein based on 100 parts by mass of the diene rubber (1), the rubber composition comprises 0.1 to 150 parts by mass of the silica (2) and 0.1 to 30 parts by mass of the epoxidized liquid diene rubber (3). A crosslinkable rubber composition includes the above rubber composition and crosslinking agent. A crosslinked article is prepared by crosslinking the above crosslinkable rubber composition. The rubber compositions have improved silica dispersibility in the case of mixing a silica with a diene rubber, excellent processability, and excellent mechanical properties after crosslinking.

Abstract: The invention provides a curable resin composition having an addition polymerization-based block copolymer (I) and an ethylenic unsaturated compound (II), wherein: the addition polymerization-based block copolymer (I) is selected from block copolymers comprising at least one polymer block A and at least one polymer block B, and the hydrogenated products thereof; the polymer block A essentially comprises an aromatic vinyl compound unit containing at least 1% by mass of an alkylstyrene-derived structural unit (a) in which at least one alkyl group having 1 to 8 carbon atoms is bound to a benzene ring; the polymer block B essentially comprises a conjugated diene compound unit; and at least the moiety of polymer block A can undergo crosslinking upon exposure to an active energy ray. Also provided is a flexographic plate material using the curable resin composition as its constituent.

Abstract: An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.