Abstract: Provided is an etching method including: (1) bringing a material containing at least one organic compound having an N—F bond into contact with the surface of a solid material; and (2) a step of heating the solid material; whereby etching can be performed safely and in a simple manner, at a higher etching rate, without the use of a high-environmental-load gas that causes global warming or highly reactive and toxic fluorine gas or hydrofluoric acid. The etching method may further include: (3) a step of exposing the solid material to light from the side of the material containing at least one organic compound having an N—F bond; and (4) a step of removing the material containing at least one organic compound having an N—F bond together with the residue remained between said material and the solid material.

Abstract: A particle detection device (10) included substrates (1, 4), insulating members (2, 3), supporting member (5), and electrodes (6, 7). The insulating member (2) is provided on a principal surface of the substrate (1) and has a recess. The insulating member (3) is provided so as to make contact with the insulating member (3) and the substrate (4). The substrate (4) is formed on a principal surface of the supporting member (5). The electrode (6) is formed on a surface, which is opposite to the surface where the insulating member (2) is formed, of the substrate (1). The electrode (7) is formed on the surface (5A), the side surface (5B), and the rear surface (5C) of the supporting member (5) so as to be connected to the substrate (4). Accordingly, the detection device 10 includes a gap (8) surrounded by the insulating members (2, 3). The substrate (1) is connected to the substrate (4) with the insulating members (2, 3) and the supporting member (5) (quartz).

Abstract: A particle detection device (10) included substrates (1, 4), insulating members (2, 3), supporting member (5), and electrodes (6, 7). The insulating member (2) is provided on a principal surface of the substrate (1) and has a recess. The insulating member (3) is provided so as to make contact with the insulating member (3) and the substrate (4). The substrate (4) is formed on a principal surface of the supporting member (5). The electrode (6) is formed on a surface, which is opposite to the surface where the insulating member (2) is formed, of the substrate (1). The electrode (7) is formed on the surface (5A), the side surface (5B), and the rear surface (5C) of the supporting member (5) so as to be connected to the substrate (4). Accordingly, the detection device 10 includes a gap (8) surrounded by the insulating members (2, 3). The substrate (1) is connected to the substrate (4) with the insulating members (2, 3) and the supporting member (5) (quartz).

Abstract: A method of forming an oxide film having high insularity capability is performed within an ultra clean environment, using charged particles.

Abstract: Vacuum processing equipment capable of preventing particles from sticking to objects to be processed in vacuum vessels. The vacuum equipment comprises a series of vacuum vessels separated by doors, and the pressure in the vessels are reducible respectively. The vessels are so configured that objects to be processed are moveable among them and there is provided light projection means for projecting ultra rays on gases introduced to at least of the vessels.

Abstract: Vacuum processing equipment capable of preventing particles from sticking to objects to be processed in vacuum vessels. The vacuum equipment comprises a series of vacuum vessels separated by doors, and the pressure in the vessels are reducible respectively. The vessels are so configured that objects to be processed are movable among them, and there is provided light projection means for projecting ultra rays on gases introduced to at least of the vessels.

Abstract: Vacuum processing equipment capable of preventing particles from sticking to objects to be processed in vacuum vessels. The vacuum equipment comprises a series of vacuum vessels separated by doors, and the pressure in the vessels are reducible respectively. The vessels are so configured that objects to be processed are movable among them, and there is provided light projection means for projecting ultra rays on gases introduced to at least of the vessels.

Abstract: The present invention relates to a method of forming an oxide film comprising;a first step to form an oxide film on the surface of a substrate by bringing a solution containing oxygen and/or oxygen-containing molecule in contact with the surface of said substrate, and a second step to strengthen bond between oxygen and atoms constituting the surface of said substrate in said oxide film by the thermal treatment of said oxide film at a temperature higher than 20.degree. C. in vapor phase of oxygen, oxygen-containing molecule, inert gas alone, or a mixture of two or more of them.