Patents by Inventor Mizuho Shirato

Mizuho Shirato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire loop, semiconductor device having same and wire bonding method
    Patent number: 8016182
    Abstract: A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: September 13, 2011
    Assignee: Kaijo Corporation
    Inventors: Mizuho Shirato, Hiromi Fujisawa, Tadahisa Akita
  • Wire loop, semiconductor device having same and wire bonding method
    Publication number: 20060255101
    Abstract: A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.
    Type: Application
    Filed: May 10, 2005
    Publication date: November 16, 2006
    Inventors: Mizuho Shirato, Hiromi Fujisawa, Tadahisa Akita